IPC TR 585 : 0

1 PURPOSE
2 INTRODUCTION
3 TASK OBJECTIVES
4 TEST PLAN
5 SAMPLE PREPARATION
6 SURFACE ANALYSIS OF SAMPLES
7 SAMPLE CONDITIONING (COUPON CONDITIONING)
8 SAMPLE TESTING
   8.1 Wetting Balance Testing
   8.2 Sequential Electrochemical Reduction Analysis
        (SERA) Testing
   8.3 Dip and Look Testing
   8.4 Wetting Balance Testing
   8.5 SERA Testing
9 DATA ANALYSIS
   9.1 Wetting Balance Results
   9.2 Visual
10 CONCLUSIONS
   10.1 Conclusions By Finish
        10.1.1 Bare Copper
        10.1.2 RTL
        10.1.3 Immersion Silver
        10.1.4 Immersion Tin
        10.1.5 Electroless Nickel/Immersion Gold (ENIG)
        10.1.6 OSP
   10.2 Investigation Confirmation Testing
11 RECOMMENDATIONS
Appendix 1: Coupon Numbering System
Appendix 2 A: Charts for Reflowed Tin Lead
Appendix 2 B: Charts for Bare Copper
Appendix 2 C: Charts for Immersion Silver
Appendix 2 D: Charts for Immersion Tin
Appendix 2 E: Charts for Nickel Gold
Appendix 2 F: Charts for OSP
Appendix 3: Pareto Chart Analysis
Appendix 4: 'Stop Light' Analyses of Wetting
            Balance Data
Appendix 5: Relative Stoplight and Box-and-Whisker
            Analysis of SERA Data
Appendix 6: Solderability Visual Exam
Appendix 7: Statement of Work for This Project at
            the Start
Appendix 8: IPC Dip and Look Test Method
Appendix 9: Further Analysis of the Alternate Final
            Finishes Task Group Report on Time,
            Temperature and Humidity Stress of Final
            Board Finish Solderability