IPC 2221B:2012
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
GENERIC STANDARD ON PRINTED BOARD DESIGN
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
20-11-2012
Publisher
Superseded date
22-01-2024
Superseded by
Excluding VAT
1 SCOPE
2 APPLICABLE DOCUMENTS
3 GENERAL REQUIREMENTS
4 MATERIALS
5 MECHANICAL/PHYSICAL PROPERTIES
6 ELECTRICAL PROPERTIES
7 THERMAL MANAGEMENT
8 COMPONENT AND ASSEMBLY ISSUES
9 HOLES/INTERCONNECTIONS
10 GENERAL CIRCUIT FEATURE REQUIREMENTS
11 DOCUMENTATION
12 QUALITY ASSURANCE
APPENDIX A
APPENDIX B
APPENDIX C - Example of a Testability Design Checklist
This standard establishes the generic requirements for the design of organic printed boards and other forms of componentmounting or interconnecting structures, including PC card form factors.
| DevelopmentNote |
Supersedes MIL STD 2118, IPC D 949 & IPC ML 910. Together with IPC 2222 & IPC 2223 supersedes IPC D 249 & IPC D 275. Also available in CD-ROM format. Included in IPC 2220, IPC C 102, IPC C 106, IPC C 105 & IPC C 1000. (07/2009) A2003 is still active in Chinese Language, See separate record. (11/2012) Also available in German Language, See IPC 2221 GERMAN. (11/2013) Also available in French Language, See IPC 2221 FRENCH. (07/2015)
|
| DocumentType |
Revision
|
| ISBN |
978-1-61193-069-6
|
| Pages |
170
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| DSCC 11001 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
| MIL-DTL-21097 Revision H:2017 | Connectors, Electrical, Printed Wiring Board, General Purpose General Specification for |
| DSCC 11004 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
| I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
| MIL-HDBK-1861 Revision B:2013 | Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware |
| DSCC 11005 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| I.S. EN 140402-801:2015 | DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| BS EN 50155:2017 | Railway applications. Rolling stock. Electronic equipment |
| 16/30282633 DC : 0 | BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK |
| EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2 |
| EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| MIL-PRF-50884 Revision F:2014 | Printed Wiring Board, Flexible or Rigid-Flex, General Specification for |
| IPC 2224 : 0 | SECTIONAL STANDARD FOR DESIGN OF PWBS FOR PC CARDS |
| MIL-DTL-29563 Revision B:2014 | Antenna System, Aims Shipboard, Electronically Steered OE-120/UPX |
| DEFSTAN 00-970(PT0)/9(2012) : 2012 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
| DEFSTAN 08-107/3(2013) : 2013 | GENERAL REQUIREMENTS FOR THE DESIGN OF ELECTROTECHNICAL AND NAVAL WEAPON EQUIPMENT |
| MIL P 50884 : E | PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
| DEFSTAN 00-970(PT0)/17(2016) : 2016 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
| DEFSTAN 00-970(PT0)/7(2011) : 2011 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
| DEFSTAN 00-970(PT0)/14(2014) : 2014 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
| MIL-PRF-55110 Revision H:2014 | Printed Wiring Board, Rigid, General Specification for |
| MIL-PRF-31032-2 Revision C:2017 | Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or Without Plated-Through Holes, for Soldered Part Mounting |
| IPC 2611 : 0 | GENERIC REQUIREMENTS FOR ELECTRONIC PRODUCT DOCUMENTATION |
| IPC 2612-1 : 0 | SECTIONAL REQUIREMENTS FOR ELECTRONIC DIAGRAMMING SYMBOL GENERATION METHODOLOGY |
| MIL-PRF-31032-1 Revision D:2017 | Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or Without Blind and Buried Plated-Through Holes, for Soldered Part Mounting |
| IPC 2612 : 0 | SECTIONAL REQUIREMENTS FOR ELECTRONIC DIAGRAMMING DOCUMENTATION (SCHEMATIC AND LOGIC DESCRIPTIONS) |
| MIL-DTL-7788 Revision H:2011 | Panels, Information, Integrally Illuminated |
| IPC 2588 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION |
| DEFSTAN 00-970(PT0)/13(2014) : 2014 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
| DEFSTAN 00-970(PT0)/11(2013) : 2013 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
| MIL-DTL-917 Revision F:2014 | Electric Power Equipment, Basic Requirements for |
| DEFSTAN 00-970(PT0)/15(2015) : 2015 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
| MIL-PRF-31032-4 Revision C:2017 | Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting |
| MIL-PRF-31032-6 Revision B:2017 | Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic or Thermosetting Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications |
| DEFSTAN 00-970(PT0)/12(2014) : 2014 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
| IPC 2152 : 0 | STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN |
| MIL-PRF-31032-3 Revision C:2017 | Printed Wiring Board, Flexible, Single and Double Layer, with or Without Plated-Through Holes, with or Without Stiffeners, for Soldered Part Mounting |
| MIL-PRF-31032-5 Revision B:2017 | Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated-Through Holes, for High Frequency Applications |
| IPC 2582 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
| MIL-PRF-3098 Revision L:2017 | Crystal Units, Quartz General Specification for |
| DEFSTAN 00-970(PT0)/8(2011) : 2011 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
| IPC 2614 : 0 | SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION |
| DEFSTAN 00-970(PT0)/10(2013) : 2013 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| DEFSTAN 00-970(PT0)/16(2015) : 2015 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
| I.S. EN 61189-3-719:2016 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING |
| PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
| 13/30295427 DC : 0 | BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| I.S. EN 50155:2017-11 | RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT |
| IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| MIL-DTL-22442 Revision G:2009 | Cable Assemblies, Aircraft Audio, General Specification for |
| IEEE 1725-2011 | IEEE Standard for Rechargeable Batteries for Cellular Telephones |
| MIL-DTL-21097-15 Revision G:2005 | Connectors, Electrical, Printed Wiring Board Male Adapter, Contact Spacing: 0.200, Alternate Dual Row, Type CS, Blade Contact (No Mounting Provision) |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| NASA KSC E 165 : 2009 | ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR |
| MIL-DTL-39024 Revision C:2014 | Jack, Tip (Test Point, Panel or Printed Wiring Type), General Specification for |
| NASA MSFC STD 3425 : 2006 | MULTIPROGRAM/PROJECT COMMON-USE DOCUMENT DESIGN STANDARD FOR RIGID PRINTED CIRCUIT BOARDS AND ASSEMBLIES |
| NASA MSFC STD 2907 : 2006 | WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS |
| NASA STD 5005 : 2013 | STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT |
| NASA STD 5005(INT) : 2007 | THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT |
| NASA KSC DE 512-SM : 2012 | FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS |
| NASA KSC STD E 0001 : 2008 | DESIGN OF ELECTRICAL CONTROL AND MONITORING SYSTEMS, EQUIPMENT (GSE), AND PANELS, STANDARD FOR |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| EN 50155:2017 | Railway applications - Rolling stock - Electronic equipment |
| NASA JSC 27301 : 2009 | MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| MIL-DTL-55302 Revision G:2009 | Connectors, Printed Circuit Subassembly and Accessories |
| MIL-DTL-21097-14 Revision F:2005 | Connectors, Electrical, Printed Wiring Board Male Adapter, Contact Spacing: 0.200, Alternate Dual Row, Type CS, Blade Contact (Mounting Provision A) |
| MIL-DTL-21097-3 Revision F:2005 | Connectors, Electrical, Printed Wiring Board Composite, Adapter, Contact Spacing (.200) Individual Contacts, Type CS |
| DSCC 11002 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| DSCC 11003 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| IEC PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
| IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
| IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC 61189-3-719:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling |
| IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| BS EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2 |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| PD IEC/PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| BS EN 61189-3-719:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| EN 61189-3-719:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling |
| I.S. EN 16602-70-12:2016 | SPACE PRODUCT ASSURANCE - DESIGN RULES FOR PRINTED CIRCUIT BOARDS |
| DSCC 10012 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING |
| ASME Y14.24 : 2012 | TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| ASME Y14.100 : 2017 | ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| DSCC 10013 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES |
| DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
| DSCC 10014:2012 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS |
| ASME Y14.31 : 2014 | UNDIMENSIONED DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| SAE AIR7374 | Aging Mechanisms of Electrical Insulation Materials in a High Energy System |
| ASME Y14.31:2014(R2019) | Undimensioned Drawings |
| IPC-2231:2019 | DFX Guidelines |
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| SAE AMSQQN290C | Nickel Plating (Electrodeposited) |
| IPC 2141 : A:2004 | DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS |
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| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IEEE 1149.1-2013 REDLINE | IEEE Standard for Test Access Port and Boundary-Scan Architecture |
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