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IPC 4781 : 0

Current

Current

The latest, up-to-date edition.

QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT, SEMI-PERMANENT AND TEMPORARY LEGEND AND/OR MARKING INK

Available format(s)

Hardcopy

Language(s)

English

Published date

30-05-2008

1 SCOPE AND DESIGNATION
  1.1 Scope
  1.2 Purpose
  1.3 Types
  1.4 Presentation
  1.5 Terms and Definitions
       1.5.1 AABUS
       1.5.2 Chalking
       1.5.3 Color Change (Cured Legend or Marking Ink)
       1.5.4 CoC (or C of C)
       1.5.5 Crazing (Cured Legend or Marking Ink)
       1.5.6 Delamination (Cured Legend or Marking Ink)
       1.5.7 FTIR
       1.5.8 Legend Ink
       1.5.9 Liquefaction
       1.5.10 Marking Ink
       1.5.11 PB
       1.5.12 Peeling (Cured Legend or Marking Ink)
       1.5.13 SAC 305
       1.5.14 Softening (Cured Legend or Marking Ink)
       1.5.15 Solder Mask
       1.5.16 Swelling (Cured Legend or Marking Ink)
       1.5.17 Tackiness (Cured Legend or Marking Ink)
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 Underwriters Laboratories
  2.3 ASTM
  2.4 Precedence of Documents
3 REQUIREMENTS
  3.1 Qualification/Conformance
       3.1.1 Material Qualification and Conformance
       3.1.2 PB Process Qualification and Assessment
       3.1.3 Requalification
       3.1.4 Legibility
       3.1.5 Test Vehicle and Legend/Marking Pattern
  3.2 Materials
       3.2.1 Cleanliness
       3.2.2 Cure and Drying
       3.2.3 Formulation Change
       3.2.4 Compatibility
       3.2.5 Shelf Life
       3.2.6 Color
       3.2.7 Cure and/or Drying
       3.2.8 Non-Nutrient
  3.3 Visual Requirements
       3.3.1 Appearance
       3.3.2 Discoloration (Metallic Surfaces)
       3.3.3 Discoloration After Soldering Conditions
  3.4 Dimensional Requirements
       3.4.1 Legend and Marking Ink Thickness
  3.5 Physical Requirements
       3.5.1 Pencil Hardness
       3.5.2 Adhesion
  3.6 Chemical Requirements
       3.6.2 Hydrolytic Stability
       3.6.3 Flammability
  3.7 Soldering Requirements
       3.7.1 Solderability
       3.7.2 Resistance to Tin-Lead Solder
       3.7.3 Resistance to Lead-Free Solder
  3.8 Electrical Requirements
       3.8.1 Dielectric Constant and Dissipation Factor
  3.9 Environmental Requirements
       3.9.1 Moisture and Insulation Resistance
       3.9.2 Electrochemical Migration
       3.9.3 Thermal Shock
  3.10 Color/Hiding Power and Contrast
  3.11 Gloss
  3.12 Environmental Compliance
  3.13 Outgassing Test
  3.14 Compatibility with Other Processing Materials
  3.15 Resolution/Legibility and Feature Size
4 QUALITY ASSURANCE PROVISIONS
  4.1 Responsibility for Testing/Inspection
       4.1.1 Initial Qualification Testing
       4.1.2 Test or Inspection Facilities
  4.2 Qualification Inspection
       4.2.1 Sample Size
       4.2.2 Inspection Routine
       4.2.3 Failures
  4.3 Quality Conformance
       4.3.1 Testing/Inspection of Product for Delivery
  4.4 Preparation of Specimens for Test
       4.4.1 Standard Laboratory Conditions
       4.4.2 Specimen Selection
       4.4.3 Coating
       4.4.4 Number
5 PREPARATION OF LEGEND AND MARKING INK MATERIAL FOR
  DELIVERY
  5.1 Preservation, Packaging and Packing
6 NOTES
  6.1 Specifying Legend and Marking Ink on PBs
  6.2 Special Requirements

Provides coverage for adhesion, material qualification and testing, resistances to solvents, requirements for resistance to lead-free solders, and electrical requirements.

DevelopmentNote
Included in IPC C 105 & IPC C 1000. (07/2008)
DocumentType
Standard
Pages
17
PublisherName
Institute of Printed Circuits
Status
Current

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