|
IPC J STD 609 : A
|
MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
|
IPC A 600 : H
|
ACCEPTABILITY OF PRINTED BOARDS |
|
IPC T 50 : M
|
TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
|
IPC 4552 : 0
|
PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS |
|
IPC 6011 : 0
|
GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
|
IPC 4553 : A
|
SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
|
IPC 4202 : A
|
FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS |
|
IPC 9252 : A
|
REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS |
|
IPC J STD 001 : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
|
IPC JP002 : 0
|
JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE |
|
IPC CC 830 : B
|
QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
|
IPC D 325 : A
|
DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
|
IPC 4203 : A
|
COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY |
|
IPC 4563 : 0
|
RESIN COATED COPPER FOIL FOR PRINTED BOARDS GUIDELINE |
|
ASME B46.1 : 2009
|
SURFACE TEXTURE (SURFACE ROUGHNESS, WAVINESS, AND LAY) |
|
IPC J STD 006 : C
|
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
|
IPC TM 650 : 0
|
TEST METHODS MANUAL |
|
IPC SM 840 : E
|
QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
|
IPC HDBK 001 : E
|
HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001 |
|
IPC 4811 : 0
|
SPECIFICATION FOR EMBEDDED PASSIVE DEVICE RESISTOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
|
IPC 2251 : 0
|
DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS |
|
IPC 9151 : D
|
PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE |
|
IPC 4101 : D
|
SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
|
ASTM B 679 : 1998
|
Standard Specification for Electrodeposited Coatings of Palladium for Engineering Use |
|
IPC 2221B:2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN |
|
IPC 9691 : A
|
USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING |
|
IPC 4821 : 0
|
SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
|
SAE AMS QQ A 250 B : 2012
|
ALUMINUM AND ALUMINUM ALLOY, PLATE AND SHEET GENERAL SPECIFICATION FOR |
|
IPC 7711/21 : B
|
REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES |
|
IPC QL 653 : A
|
Certification of Facilities that Inspect/Test Printed Boards, Components & Materials |
|
IPC 4781 : 0
|
QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT, SEMI-PERMANENT AND TEMPORARY LEGEND AND/OR MARKING INK |
|
NEMA LI 1 : 1998(R2011)
|
INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS |
|
IPC 4562 : A
|
METAL FOIL FOR PRINTED BOARD APPLICATIONS |
|
IPC J STD 003 : C
|
SOLDERABILITY TESTS FOR PRINTED BOARDS |
|
IPC DD 135 : 0
|
QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES |
|
IPC 4554 : 0
|
SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
|
IPC CF 152 : B
|
COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS |
|
IPC A 47 : 1996
|
COMPOSITE TEST PATTERN TEN-LAYER PHOTOTOOL |
|
IPC 6016 : 0
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS |
|
QQ-S-635 Revision B:1976
|
STEEL PLATE, CARBON |
|
IPC 4103 : A
|
SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS |