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Development Note
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German translation of J2016 Edition is issued in June 2016. (01/2017) Also available in Hardcopy format. (01/2018) |
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Document Type
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Standard |
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ISBN
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Pages
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Published
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Publisher
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Institute of Printed Circuits
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Status
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Current |
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IPC T 50 : M
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TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
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IPC 2220 : LATEST
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IPC 2220 FAMILY OF DESIGN DOCUMENTS |
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IPC 6010 SERIES : LATEST
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IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
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ASME B46.1 : 2009
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SURFACE TEXTURE (SURFACE ROUGHNESS, WAVINESS, AND LAY) |
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IPC TM 650 : 0
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TEST METHODS MANUAL |
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IPC SM 840 : E
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QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
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IPC 9691 : A
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USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING |
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IPC 4781 : 0
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QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT, SEMI-PERMANENT AND TEMPORARY LEGEND AND/OR MARKING INK |
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IPC 4562 : A
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METAL FOIL FOR PRINTED BOARD APPLICATIONS |
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IPC J STD 003 : C
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SOLDERABILITY TESTS FOR PRINTED BOARDS |
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IPC 9191 : 0
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GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
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