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  • IPC 6013 GERMAN : B

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS

    Available format(s):  Hardcopy

    Superseded date:  01-09-2017

    Language(s):  German

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Diese Spezifikation deckt die Anforderungen an die Qualifikation und Leistungsspezifikation fuer flexible Leiterplatten gemäss IPC-2221 und IPC-2223 ab. Die flexible Leiterplatte kann einseitig, zweiseitig, als Multilayer oder Starrflex-Multilayer ausgefuehrt sein. All diese Aufbauvarianten können, muessen aber nicht, Versteifungen, durchmetallisierte Löcher und Sacklöcher/vergrabene Löcher (blind/buried vias) enthalten.

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    Development Note Also available in CD-ROM format. (09/2011)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    SAE AMS 2424 : 2010 PLATING, NICKEL LOW-STRESSED DEPOSIT
    IPC 4552 : 0 PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS
    IPC 6011 : 0 GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
    IPC 4553 : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
    IPC 4202 : A FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS
    IPC 4761 : 0 DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES
    IPC 9252 : A REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
    IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
    IPC 4203 : A COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY
    IPC 4563 : 0 RESIN COATED COPPER FOIL FOR PRINTED BOARDS GUIDELINE
    ASME B46.1 : 2009 SURFACE TEXTURE (SURFACE ROUGHNESS, WAVINESS, AND LAY)
    IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IPC 4811 : 0 SPECIFICATION FOR EMBEDDED PASSIVE DEVICE RESISTOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC 2251 : 0 DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS
    IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 9691 : A USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING
    SAE AMS QQ A 250 B : 2012 ALUMINUM AND ALUMINUM ALLOY, PLATE AND SHEET GENERAL SPECIFICATION FOR
    IPC 7711/21 : B REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
    IPC QL 653 : A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
    IPC 4204 : A FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
    IPC 4781 : 0 QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT, SEMI-PERMANENT AND TEMPORARY LEGEND AND/OR MARKING INK
    NEMA LI 1 : 1998(R2011) INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS
    IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
    IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    IPC DD 135 : 0 QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES
    IPC CF 152 : B COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
    IPC 2223 : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
    IPC 4103 : A SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS
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