IPC 4811 : 0
Current
The latest, up-to-date edition.
SPECIFICATION FOR EMBEDDED PASSIVE DEVICE RESISTOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
Hardcopy
English
30-05-2008
1 SCOPE
1.1 General
1.2 Designation System
1.2.1 Resistor Passive Device Designations
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 National Conference of Standards Laboratories (NCSL)
2.3 JEDEC Standards
2.4 International Standards
3 REQUIREMENTS
3.1 Terms and Definitions
3.1.1 AABUS (As Agreed Upon Between User and Supplier)
3.2 Specification Sheets
3.3 Supplier's Quality Profile
3.4 Qualification (Characterization) Testing
3.4.1 Material Qualification
3.5 Conformance Testing
3.5.1 Samples
3.5.2 Frequency
3.6 Verification of Supplier's Quality System
3.7 Conflict
3.8 Materials
3.8.1 Resistor Materials in Laminate-Like Form
3.8.2 Resistor Materials in Nonlaminate-Like Form
3.8.3 Encapsulant Materials in Nonlaminate-Like Form
3.8.4 Conductor/Termination Materials
3.9 General Acceptability
3.9.1 General Acceptability of Resistor Materials
3.9.2 General Acceptability of Conductive Paste Materials
3.9.3 Inspection
3.10 Visual Requirements
3.10.1 Visual Requirements of Laminate-Like Resistor
Materials
3.10.2 Visual Requirements of Nonlaminate-Like Resistor
and Associated Materials
3.11 Dimensional Requirements
3.11.1 Dimensional Requirements of Laminate-Like Resistor
Materials
3.11.2 Dimensional Requirements of Nonlaminate-Like
Resistor Materials
3.12 Mechanical Requirements
3.12.1 Mechanical Requirements of Laminate-Like Resistor
Materials
3.12.2 Mechanical Requirements of Nonlaminate-Like Resistor
Materials
3.13 Electrical Requirements
3.13.1 Electrical Requirements of Laminate-Like Resistor
Materials
3.13.2 Electrical Requirements of Nonlaminate-Like Resistor
Materials
3.14 Environmental Requirements
3.14.1 Environmental Requirements of Laminate-Like
Resistor Materials
3.14.2 Environmental Requirements of Nonlaminate-Like
Resistor Materials
3.15 Workmanship
3.16 Material Safety Data Sheets
3.17 Shelf Life
3.18 Marking
4 QUALITY ASSURANCE PROVISIONS
4.1 Quality System
4.2 Responsibility for Inspection
4.2.1 Test Equipment and Inspection Facilities
4.2.2 Standard Laboratory Conditions
4.3 Qualification (Characterization) Testing
4.3.1 Samples
4.3.2 Structurally Similar Construction
4.4 Quality Conformance Inspection
4.4.1 Frequency
4.4.2 Inspection of Product for Delivery
4.4.3 Acceptance Criteria
4.4.4 Rejected Lots
4.5 Statistical Process Control (SPC)
5 PREPARATION FOR DELIVERY
5.1 Packaging
6 NOTES
6.1 Ordering Data
6.2 Electrostatic Discharge (ESD) Testing
6.3 Short Time Overload
7 REFERENCES
Specification Sheets for Embedded Passive Device Materials
Describes materials that can be used for the fabrication of embedded passive resistor devices within the finished printed circuit board substrate.
DevelopmentNote |
Included in IPC C 107. (06/2008) Included in IPC C 105 & IPC C 1000. (07/2008)
|
DocumentType |
Standard
|
Pages |
26
|
PublisherName |
Institute of Printed Circuits
|
Status |
Current
|
IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 7092 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS |
IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
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