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IPC 4811 : 0

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR EMBEDDED PASSIVE DEVICE RESISTOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS

Available format(s)

Hardcopy

Language(s)

English

Published date

30-05-2008

€129.39
Excluding VAT

1 SCOPE
  1.1 General
  1.2 Designation System
       1.2.1 Resistor Passive Device Designations
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 National Conference of Standards Laboratories (NCSL)
  2.3 JEDEC Standards
  2.4 International Standards
3 REQUIREMENTS
  3.1 Terms and Definitions
       3.1.1 AABUS (As Agreed Upon Between User and Supplier)
  3.2 Specification Sheets
  3.3 Supplier's Quality Profile
  3.4 Qualification (Characterization) Testing
       3.4.1 Material Qualification
  3.5 Conformance Testing
       3.5.1 Samples
       3.5.2 Frequency
  3.6 Verification of Supplier's Quality System
  3.7 Conflict
  3.8 Materials
       3.8.1 Resistor Materials in Laminate-Like Form
       3.8.2 Resistor Materials in Nonlaminate-Like Form
       3.8.3 Encapsulant Materials in Nonlaminate-Like Form
       3.8.4 Conductor/Termination Materials
  3.9 General Acceptability
       3.9.1 General Acceptability of Resistor Materials
       3.9.2 General Acceptability of Conductive Paste Materials
       3.9.3 Inspection
  3.10 Visual Requirements
       3.10.1 Visual Requirements of Laminate-Like Resistor
              Materials
       3.10.2 Visual Requirements of Nonlaminate-Like Resistor
              and Associated Materials
  3.11 Dimensional Requirements
       3.11.1 Dimensional Requirements of Laminate-Like Resistor
              Materials
       3.11.2 Dimensional Requirements of Nonlaminate-Like
              Resistor Materials
  3.12 Mechanical Requirements
       3.12.1 Mechanical Requirements of Laminate-Like Resistor
              Materials
       3.12.2 Mechanical Requirements of Nonlaminate-Like Resistor
              Materials
  3.13 Electrical Requirements
       3.13.1 Electrical Requirements of Laminate-Like Resistor
              Materials
       3.13.2 Electrical Requirements of Nonlaminate-Like Resistor
              Materials
  3.14 Environmental Requirements
       3.14.1 Environmental Requirements of Laminate-Like
              Resistor Materials
       3.14.2 Environmental Requirements of Nonlaminate-Like
              Resistor Materials
  3.15 Workmanship
  3.16 Material Safety Data Sheets
  3.17 Shelf Life
  3.18 Marking
4 QUALITY ASSURANCE PROVISIONS
  4.1 Quality System
  4.2 Responsibility for Inspection
       4.2.1 Test Equipment and Inspection Facilities
       4.2.2 Standard Laboratory Conditions
  4.3 Qualification (Characterization) Testing
       4.3.1 Samples
       4.3.2 Structurally Similar Construction
  4.4 Quality Conformance Inspection
       4.4.1 Frequency
       4.4.2 Inspection of Product for Delivery
       4.4.3 Acceptance Criteria
       4.4.4 Rejected Lots
  4.5 Statistical Process Control (SPC)
5 PREPARATION FOR DELIVERY
  5.1 Packaging
6 NOTES
  6.1 Ordering Data
  6.2 Electrostatic Discharge (ESD) Testing
  6.3 Short Time Overload
7 REFERENCES
Specification Sheets for Embedded Passive Device Materials

Describes materials that can be used for the fabrication of embedded passive resistor devices within the finished printed circuit board substrate.

DevelopmentNote
Included in IPC C 107. (06/2008) Included in IPC C 105 & IPC C 1000. (07/2008)
DocumentType
Standard
Pages
26
PublisherName
Institute of Printed Circuits
Status
Current

IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
IPC 6013 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS

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