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IPC T 50 : M
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TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
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ISO/IEC 17025:2005
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General requirements for the competence of testing and calibration laboratories |
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IPC D 356 : B
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BARE SUBSTRATE ELECTRICAL TEST DATA FORMAT |
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IPC SM 784 : 0
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GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION |
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IPC 4761 : 0
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DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
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IPC 9252 : A
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REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS |
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IPC J STD 001 : F
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
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IPC 4563 : 0
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RESIN COATED COPPER FOIL FOR PRINTED BOARDS GUIDELINE |
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IPC TM 650 : 0
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TEST METHODS MANUAL |
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IPC 4811 : 0
|
SPECIFICATION FOR EMBEDDED PASSIVE DEVICE RESISTOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
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IPC J STD 033C-1:2014
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HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
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IPC 9151 : D
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PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE |
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IPC 4101 : D
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SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
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IPC 7351 : B
|
GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
|
GEIA STD 0005-2 : 2012
|
MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
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IEC 61000-4-2:2008
|
Electromagnetic compatibility (EMC) - Part 4-2: Testing and measurement techniques - Electrostatic discharge immunity test |
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IPC 7094 : 0
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS |
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IPC 4821 : 0
|
SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
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IPC D 279 : 0
|
DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
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GEIA STD 0005-1 : 2012
|
PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
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IPC 9701 : A
|
PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
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IPC QL 653 : A
|
Certification of Facilities that Inspect/Test Printed Boards, Components & Materials |
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IPC 4562 : A
|
METAL FOIL FOR PRINTED BOARD APPLICATIONS |
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IPC J STD 075 : 0
|
CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
|
IPC 2581 : B
|
GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
|
ASME Y14.100 : 2017
|
ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
|
IPC 9191 : 0
|
GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
|
IPC SM 785 : 0
|
GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS |
|
IPC 2316 : 0
|
DESIGN GUIDE FOR EMBEDDED PASSIVE DEVICE PRINTED BOARDS |
|
IPC 6012 : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |