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IPC 7530 : 0

Current

Current

The latest, up-to-date edition.

GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)

Available format(s)

Hardcopy

Language(s)

English

1 SCOPE
2 APPLICABLE DOCUMENTS
3 CONVECTION REFLOW PROFILING
4 VAPOR-PHASE REFLOW PROFILING
5 WAVE SOLDERING PROFILING
6 SELECTIVE SOLDERING PROFILING
7 TEMPERATURE PROFILING TOOLS
8 TROUBLESHOOTING

Specifies thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow and wave soldering.

DevelopmentNote
2001 Edition are still available in Chinese & Hungarian Languages, See IPC 7530 CHINESE & IPC 7530 HUNGARIAN. (05/2017) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
Pages
33
PublisherName
Institute of Printed Circuits
Status
Current

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IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
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