IPC 7530 : 0
Current
The latest, up-to-date edition.
GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)
Hardcopy
English
1 SCOPE
2 APPLICABLE DOCUMENTS
3 CONVECTION REFLOW PROFILING
4 VAPOR-PHASE REFLOW PROFILING
5 WAVE SOLDERING PROFILING
6 SELECTIVE SOLDERING PROFILING
7 TEMPERATURE PROFILING TOOLS
8 TROUBLESHOOTING
Specifies thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow and wave soldering.
| DevelopmentNote |
2001 Edition are still available in Chinese & Hungarian Languages, See IPC 7530 CHINESE & IPC 7530 HUNGARIAN. (05/2017) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
33
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
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