IPC 7721 : 1998
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
REPAIR AND MODIFICATION OF PRINTED BOARDS AND ELECTRONIC ASSEMBLIES
01-10-2003
12-01-2013
1 General
2 Handling/Cleaning
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.3 Coating Removal
2.4 Coating Replacement
2.5 Baking and Preheating
2.6 Epoxy Mixing and Handling
2.7 Legends/Marking
3 Blisters and Delamination
3.1 Delamination/Blister Repair, Injection Method
3.2 Bow and Twist Repair
3.3 Hole Repair
3.4 Key and Slot Repair
3.5 Base Material Repair
4 Lifted Conductors
4.2 Conductor Repair
4.3 Conductor Cut
4.4 Lifted Land Repair
4.5 Land Repair
4.6 Edge Contact Repair
4.7 Surface Mount Pad Repair
5 Plated Hole Repair
5.1 Plated Hole Repair, No Inner Layer Connection
5.2 Plated Hole Repair, Double Wall Method
5.3 Plated Hole Repair, Inner Layer Connection
Procedures are covered for modifying, reworking, and repairing printed boards and printed assemblies. Covers internal circuits, surface mount land and plated through-hole and edge contacts. Repair methods are listed for burr holes, legend marking, blisters and delamination, bow and twist, and base materials. Details coating removal and replacement, jumper wires, cutting conductors, and handling.
| DevelopmentNote |
Supersedes IPC R 700. (08/1998) This document is included in IPC 7711/21 (7711 AND 7721 PACKAGE). (06/2002) Included in the IPC E 500 Collection. (09/2003)
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| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| IPC D 326 : A | INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES |
| IPC J STD 033 RUSSIAN : B | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICES |
| IPC J STD 033 CHINESE : B-1 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICES |
| IPC J STD 033 GERMAN : C | HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW AND/OR PROCESS SENSITIVE COMPONENTS |
| IPC J STD 033 ITALIAN : B | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICES |
| ARINC 669 : 2004 | GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| ARINC 671 : 2006 | GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
| IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
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