IPC 7711/21 : B
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
Publisher
Superseded date
05-02-2021
Superseded by
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Describes procedures for repairing and reworking printed board assemblies.
| DevelopmentNote |
Supersedes IPC R 700, IPC 7711 and IPC 7721. (05/2016) B2007 Edition is still available in Chinese, Czech, German, Danish, French, Hungarian, Italian, Korean, Polish, Romanian, Russian, Spanish, Swedish & Turkish languages, See separate records. (02/2017) Also available in Hardcopy format. (01/2018)
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| DocumentType |
Standard
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| NASA KSC E 165 : 2009 | ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR |
| IEC TS 62647-23:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| PD IEC/TS 62647-23:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| DD IEC PAS 62647-23 : DRAFT AUG 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
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