IPC 7711/21 : B
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
Amended by
Available format(s)
PDF
Language(s)
Hungarian, Italian, Danish, Romanian, Moldavian, Moldovan, Korean, English, Spanish, Castilian, Swedish, French, Polish, German
Published date
30-11-2007
Publisher
Superseded date
05-02-2021
Superseded by
Excluding VAT
Describes procedures for repairing and reworking printed board assemblies.
| DevelopmentNote |
Supersedes IPC R 700, IPC 7711 and IPC 7721. (05/2016) B2007 Edition is still available in Chinese, Czech, German, Danish, French, Hungarian, Italian, Korean, Polish, Romanian, Russian, Spanish, Swedish & Turkish languages, See separate records. (02/2017) Also available in Hardcopy format. (01/2018)
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| DocumentType |
Standard
|
| Pages |
364
|
| ProductNote |
New Child AMD 2 2014 is now added New Child AMD 1 2011 is now added
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC A 610 DANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 SPANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 ROMANIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC A 610 CZECH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 GERMAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 POLISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 ITALIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC HDBK 850 : 0 | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY |
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| IPC A 610 SWEDISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 610 HUNGARIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 7351 GERMAN : B | Basic requirements for SMT design and SMD patch guideline |
| IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 610 JAPANESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| IPC A 610 VIETNAMESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| NASA KSC E 165 : 2009 | ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR |
| IPC J STD 030 : A | SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS |
| IEC TS 62647-23:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| PD IEC/TS 62647-23:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| DD IEC PAS 62647-23 : DRAFT AUG 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
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