• IPC D 326 : A

    Current The latest, up-to-date edition.

    INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES

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    Published date:  01-01-2004

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1.0 SCOPE
         1.1 Purpose
         1.2 Classification
    2.0 APPLICABLE AND REFERENCE DOCUMENTS
         2.1 Applicable Documents
         2.2 Reference Documents
    3.0 DOCUMENTATION CONSIDERATIONS
         3.1 Terms and Definitions
    4.0 THE STATEMENT OF WORK
         4.1 Bill of Materials
         4.2 Assembly Identification
         4.3 Documentation Listing
         4.4 Test Requirements
         4.5 Programmable Devices
         4.6 Packaging for Shipment
         4.7 Marking Requirements
         4.8 Quality System Requirements
         4.9 ESS Requirements
         4.10 Workmanship Standards
         4.11 Models or Illustrations
         4.12 Quantity and Delivery
         4.13 Other Relevant Business Practices for
              Assembly Services
    5.0 THE BILL OF MATERIAL
         5.1 Component Detail
         5.2 Qualified Parts List
         5.3 Component History Records
         5.4 Component Traceability Record
         5.5 Defective Material Record
    6.0 THE ASSEMBLY DOCUMENTATION
         6.1 The Assembly Drawing
         6.2 Product Process Routing
         6.3 Operation Instructions
    7.0 TEST DOCUMENTATION
         7.1 Test Procedure
         7.2 Schematics
    8.0 ENVIRONMENTAL STRESS SCREENING (ESS)
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Covers the information requirements for the procurement of material, assembly, inspection, test, burn in and delivery of electronic assemblies. It outlines an effective method for transferring product assembly information within a facility or from an outside customer to a contract assembly facility.

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    Development Note Included in IPC C 106. (06/2008) Included in IPC C 103 & IPC C 1000. (07/2008)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC 7721 : 1998 REPAIR AND MODIFICATION OF PRINTED BOARDS AND ELECTRONIC ASSEMBLIES
    IPC 7711 : 1998 REWORK OF ELECTRONIC ASSEMBLIES
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC EMSI TC2 : 2002 SAMPLE MASTER ORDERING AGREEMENT FOR EMS COMPANIES AND OEMS
    IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
    IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC CM 770 : E COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS
    MIL C 45662 : 0 CALIBRATION SYSTEM REQUIREMENTS
    IPC 9191 : 0 GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
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