IPC 9708 : 0
Current
The latest, up-to-date edition.
TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING
Hardcopy
English
14-12-2010
1 SCOPE
2 APPLICABLE DOCUMENTS
3 TEST METHODS
4 REFERENCES
Specifies test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads.
DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (12/2010) Also available in Chinese language, See IPC 9708 CHINESE. (07/2013)
|
DocumentType |
Standard
|
Pages |
17
|
PublisherName |
Institute of Printed Circuits
|
Status |
Current
|
IPC 9704 CHINESE : - | PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE |
IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
IPC 9704 : A | PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE |
IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
IPC 6011 : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.