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  • IPC 9704 : A

    Current The latest, up-to-date edition.

    PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE

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    Language(s): 

    Published date:  03-02-2012

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 GENERAL REQUIREMENTS/GUIDELINES
    4 DATA ANALYSIS AND REPORTING
    5 CONCLUSIONS
    6 FUTURE STUDIES
    APPENDIX A - ICT DESIGN CONSIDERATIONS
    APPENDIX B - ACRONYMS

    Abstract - (Show below) - (Hide below)

    Specifies specific guidelines for strain gage testing during the printed board manufacturing process, including board assembly, test, system integration and other types of operations that may induce board flexure.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in IPC C 103 & IPC C 1000. (07/2008) Jointly published by IPC and JEDEC. (02/2012) Also available in Chinese Language, See IPC 9704 CHINESE. (09/2012) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IPC 9707 : 0 SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
    IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IPC 9701 CHINESE : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC 9703 : 0 IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY
    IPC 9708 : 0 TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING
    IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
    IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
    IPC 9702 : 0 MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS
    IPC 9707 : 0 SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
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