IPC 9708 : 0
Current
Current
The latest, up-to-date edition.
TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
14-12-2010
Publisher
Excluding VAT
1 SCOPE
2 APPLICABLE DOCUMENTS
3 TEST METHODS
4 REFERENCES
Specifies test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads.
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (12/2010) Also available in Chinese language, See IPC 9708 CHINESE. (07/2013)
|
| DocumentType |
Test Method
|
| ISBN |
1-580986-76-5
|
| Pages |
17
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| IPC 9704 CHINESE : - | PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE |
| IPC 6011 : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
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