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TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING
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Available format(s): Hardcopy
Language(s): English
Published date: 14-12-2010
Publisher: Institute of Printed Circuits
1 SCOPE2 APPLICABLE DOCUMENTS3 TEST METHODS4 REFERENCES
Specifies test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads.
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