IPC D 275 : 91 AMD 1 96

1.0 Scope
1.1 Purpose
1.2 Classification
1.3 Presentation
1.4 Interpretation
1.5 Organization of Design Information
1.6 Order of Precedence
1.7 Terms and Definitions
2.0 Applicable Documents
2.1 Institute for Interconnecting and Packaging
      Electronic Circuits (IPC)
2.2 Department of Defense
2.3 Other Documents
3.0 Design Considerations
3.1 General
3.2 Design Layout
3.3 Design Features
3.4 Test Requirement Considerations
3.5 Electrical Requirement Considerations
3.6 Thermal Management Considerations
3.7 Mechanical Requirement Considerations
3.8 Materials
4.0 Component Mounting and Attachment
4.1 General Requirements
4.2 Leads Mounted in Through-Holes
4.3 Surface-Mounted Leaded Components
4.4 Surface Mount Leadless Components
4.5 Component Lead Sockets
4.6 Connectors and Interconnects
4.7 Solder Terminals, Eyelets, Fasteners, Stiffeners
      and Board Extractors
4.8 Special Wiring
5.0 Board Design Requirements
5.1 Layout Concepts
5.2 Board Geometries
5.3 Circuit Features
5.4 Holes
5.5 Coatings and Markings
6.0 Documentation & Phototooling
6.1 Layout
6.2 Master Drawing
6.3 Artwork
6.4 Production Master
6.5 Assembly Drawing
6.6 Final Schematic/Logic
6.7 Final Bill of Material
6.8 Government Deviation Requirements
7.0 Quality Assurance
7.1 Material Quality Assurance
7.2 Qualification Evaluations
7.3 Quality Conformance Evaluations
8.0 Appendix
8.1 Purpose
8.2 Material Selection
8.3 Laminate Properties
8.4 Prepreg
8.5 Material Specification
8.6 Material Designation
8.7 Commonly Used Symbology for Dimensioning and
      Tolerancing Printed Boards
8.8 Drill Sizes Recommendations for Printed Boards
9.0 Index
Numerous Figures
Numerous Tables

Establishes rules, principles and other considerations for the mechanical, electrical and producibility properties to be used to select features for the design of rigid printed boards and printed-board assemblies. The products covered are intended to meet a combination of specified performance and producibility requirements. Unique design requirements for printed boards and assemblies intended for military electronic equipment are noted as applicable. Printed boards designed in accordance with the requirements of this document for military usage are to fabricated by a manufacturer that has been qualified to the appropriate military specifications, except for printed boards intended for non-deliverable hardware. COMPANION DOCUMENT TO IPC-D-325