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  • IPC 2223 : C

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS

    Available format(s):  Hardcopy

    Superseded date:  13-09-2023

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 GENERAL REQUIREMENTS
    4 MATERIALS
    5 MECHANICAL AND PHYSICAL PROPERTIES
    6 ELECTRICAL PROPERTIES
    7 THERMAL MANAGEMENT
    8 COMPONENT AND ASSEMBLY ISSUES
    9 HOLES/INTERCONNECTIONS
    10 CONDUCTORS
    11 DOCUMENTATION
    12 QUALITY ASSURANCE
    APPENDIX A - Design Tutorial

    Abstract - (Show below) - (Hide below)

    Describes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes MIL STD 2118. Together with IPC 2221 & IPC 2222 supersedes IPC D 249 & IPC D 275. To be used in conjunction with IPC 2221. (09/2005) Included in IPC C 1000, IPC C 102, IPC C 106 & IPC 2220. (06/2008) C2011 Edition is still available in Chinese & German Languages See separate records. (09/2016) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    DSCC 11001 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
    DSCC 11004 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER
    MIL-HDBK-1861 Revision B:2013 Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware
    DSCC 11005 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
    BS EN 50155:2017 Railway applications. Rolling stock. Electronic equipment
    16/30282633 DC : 0 BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK
    MIL-PRF-50884 Revision F:2014 Printed Wiring Board, Flexible or Rigid-Flex, General Specification for
    IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
    IPC J STD 001 SWEDISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    MIL P 50884 : E PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR
    IPC J STD 001 RUSSIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 9241 : 2016 GUIDELINES FOR MICROSECTION PREPARATION
    IPC 2611 : 0 GENERIC REQUIREMENTS FOR ELECTRONIC PRODUCT DOCUMENTATION
    IPC 2612-1 : 0 SECTIONAL REQUIREMENTS FOR ELECTRONIC DIAGRAMMING SYMBOL GENERATION METHODOLOGY
    IPC 2612 : 0 SECTIONAL REQUIREMENTS FOR ELECTRONIC DIAGRAMMING DOCUMENTATION (SCHEMATIC AND LOGIC DESCRIPTIONS)
    IPC 4553 : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
    IPC 6202 : 0 IPC/JPCA PERFORMANCE GUIDE MANUAL FOR SINGLE- AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING BOARDS
    IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    IPC FA 251 : 0 GUIDELINES FOR ASSEMBLY OF SINGLE- AND DOUBLE-SIDED FLEX CIRCUITS
    IPC CH 65 CHINESE : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    MIL-DTL-917 Revision F:2014 ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR
    MIL-PRF-31032-4 Revision C:2017 PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING
    MIL-PRF-31032-3 Revision C:2017 PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING
    IPC FLXCSP0605-CD : 2005 IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE PACKAGING AND RADIO FREQUENCY IDENTIFICATION
    IPC J STD 001 HUNGARIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC FLXCSP0706-CD : 2006 IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIP SCALE PACKAGING
    IPC 4553 CHINESE : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
    IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
    IPC 2614 : 0 SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION
    IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    MIL STD 11991 : A GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES
    IPC J STD 001 DANISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
    I.S. EN 50155:2017-11 RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT
    IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    NASA STD 5005 : 2013 STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT
    NASA KSC DE 512-SM : 2012 FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    EN 50155:2017 Railway applications - Rolling stock - Electronic equipment
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    DSCC 11003 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
    DSCC 11002 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
    IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
    BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
    EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
    ASME Y14.24 : 2012 TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES
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