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IPC 2222 : A

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS

Available format(s)

Hardcopy

Superseded date

05-02-2021

Language(s)

English

1 SCOPE
2 APPLICABLE DOCUMENTS
3 GENERAL REQUIREMENTS
4 MATERIALS
5 MECHANICAL/PHYSICAL PROPERTIES
6 ELECTRICAL PROPERTIES
7 THERMAL MANAGEMENT
8 COMPONENT AND ASSEMBLY ISSUES
9 HOLE/INTERCONNECTIONS
10 GENERAL CIRCUIT FEATURE REQUIREMENTS
11 DOCUMENTATION
12 QUALITY ASSURANCE

Pertains to single-sided, double-sided or multi-layered boards. Key concepts in this document are: rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections.

Committee
D-30
DevelopmentNote
To be used in conjunction with IPC 2221. Supersedes IPC D 949 & IPC ML 910. Together with IPC 2221 & IPC 2223 supersedes IPC D 249 & IPC D 275. Included in IPC 2220, IPC C 106, IPC C 105 & IPC C 1000. (12/2010) Also available in German, Chinese & French Languages, See IPC 2222 GERMAN, CHINESE & FRENCH. (08/2015)
DocumentType
Standard
Pages
44
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

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