IPC D 326 : A
Current
The latest, up-to-date edition.
INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES
Hardcopy
English
01-01-2004
1.0 SCOPE
1.1 Purpose
1.2 Classification
2.0 APPLICABLE AND REFERENCE DOCUMENTS
2.1 Applicable Documents
2.2 Reference Documents
3.0 DOCUMENTATION CONSIDERATIONS
3.1 Terms and Definitions
4.0 THE STATEMENT OF WORK
4.1 Bill of Materials
4.2 Assembly Identification
4.3 Documentation Listing
4.4 Test Requirements
4.5 Programmable Devices
4.6 Packaging for Shipment
4.7 Marking Requirements
4.8 Quality System Requirements
4.9 ESS Requirements
4.10 Workmanship Standards
4.11 Models or Illustrations
4.12 Quantity and Delivery
4.13 Other Relevant Business Practices for
Assembly Services
5.0 THE BILL OF MATERIAL
5.1 Component Detail
5.2 Qualified Parts List
5.3 Component History Records
5.4 Component Traceability Record
5.5 Defective Material Record
6.0 THE ASSEMBLY DOCUMENTATION
6.1 The Assembly Drawing
6.2 Product Process Routing
6.3 Operation Instructions
7.0 TEST DOCUMENTATION
7.1 Test Procedure
7.2 Schematics
8.0 ENVIRONMENTAL STRESS SCREENING (ESS)
Figures
Tables
Covers the information requirements for the procurement of material, assembly, inspection, test, burn in and delivery of electronic assemblies. It outlines an effective method for transferring product assembly information within a facility or from an outside customer to a contract assembly facility.
| DevelopmentNote |
Included in IPC C 106. (06/2008) Included in IPC C 103 & IPC C 1000. (07/2008)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 7721 : 1998 | REPAIR AND MODIFICATION OF PRINTED BOARDS AND ELECTRONIC ASSEMBLIES |
| IPC 7711 : 1998 | REWORK OF ELECTRONIC ASSEMBLIES |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC EMSI TC2 : 2002 | SAMPLE MASTER ORDERING AGREEMENT FOR EMS COMPANIES AND OEMS |
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC CM 770 : E | COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS |
| MIL C 45662 : 0 | CALIBRATION SYSTEM REQUIREMENTS |
| IPC 9191 : 0 | GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
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