IPC D 355 : 0

1 SCOPE
  1.1 Purpose
  1.2 Format Compatibility
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 ANSI
  2.3 Department of Defense
  2.4 Electronic Industries Association
3 TERMS AND DEFINITIONS
  3.1 Field
  3.2 Record
  3.3 Comment Record
  3.4 Data Record
  3.5 Parameter Record
  3.6 General Record
  3.7 Data Information Module (DIM)
  3.8 Job Set
  3.9 Modal Form
  3.10 Location Field/Position Field
4 GENERAL REQUIREMENTS
  4.1 Data Hierarchy
  4.2 Basic Record Types
  4.3 Data Set Descriptions
  4.4 Transfer Media and Character Set
5 PARAMETER RECORDS
  5.1 Parameter JOB (required)
  5.2 Parameter FORM (required)
  5.3 Parameter CODE (optional)
  5.4 Parameter DIM (Data Information Module)
  5.5 Parameter UNITS (required)
  5.6 Parameter TITLE (required)
  5.7 Parameter NUM (required)
  5.8 Parameter REV (required)
  5.9 Parameter TOL
  5.10 Parameter PCB
  5.11 Parameter ENDPCB
  5.12 Parameter VER (required)
  5.13 Parameter SIDE (*)
6 COMMENT RECORDS
  6.1 Allowable Character Set
  6.2 Comment Records Utilizing 2-Byte Characters
7 PLACEMENT RECORDS
  7.1 General Placement Records (required)
  7.2 'Bad Mark' Records (optional)
  7.3 Fiducial Mark Records (required for surface
       mount)
  7.4 PCB Placement Record (required)
  7.5 Component Placement Record (required)
8 DESCRIPTION RECORDS
  8.1 Acceptance Rule Record
  8.2 Component Description Record (optional)
  8.2 Component Test Record (optional)
  8.3 Component Force Record (optional)
  8.4 Through Hole Component
  8.5 Glue Pattern Records (optional)
  8.6 Solder Paste Records (optional)
9 DESCRIPTION OF ASSEMBLY MACHINE (optional)
APPENDIX A Examples
APPENDIX B Component Rotation Convention
Figures
Tables

Covers the following topics: Electronic packaging design overview, System integration, Electronic equipment subsystems, Subsystem intraconnections, Subassembly interconnections, Discrete component interconnections, Active and passive base device interconnections, Discrete packaged components, Unpackaged devices, Reference manual.