IPC D 859 : 0
Current
Current
The latest, up-to-date edition.
DESIGN STANDARD FOR THICK FILM MULTILAYER HYBRID CIRCUITS
Available format(s)
Hardcopy
Language(s)
English
Published date
01-12-1989
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.Covers the requirements for the design of multilayer hybrid circuits that are based in industry manufacturing capabilities.
| DocumentType |
Standard
|
| Pages |
44
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| ASME Y14.24 : 2012 | TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
| IPC TF 870 : 0 | QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS |
| IPC M 106 : LATEST | TECHNOLOGY REFERENCE FOR DESIGN MANUAL |
| IPC HM 860 : 0 | SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS |
| IPC DD 135 : 0 | QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES |
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