DESIGN STANDARD FOR THICK FILM MULTILAYER HYBRID CIRCUITS

Available format(s)

Hardcopy

Language(s)

English

Published date

01-12-1989

Publisher

Institute of Printed Circuits

Covers the requirements for the design of multilayer hybrid circuits that are based in industry manufacturing capabilities.

DocumentType	Standard
Pages	44
PublisherName	Institute of Printed Circuits
Status	Current

ASME Y14.24 : 2012

TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES

IPC S 100 : LATEST	STANDARDS AND SPECIFICATIONS MANUAL
IPC TF 870 : 0	QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS
IPC M 106 : LATEST	TECHNOLOGY REFERENCE FOR DESIGN MANUAL
IPC HM 860 : 0	SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS
IPC DD 135 : 0	QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES

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Features

IPC D 859 : 0