IPC DR 572 : A

1 SCOPE
2 APPLICABLE DOCUMENTS
   2.1 IPC
3 TERMS AND DEFINITIONS
   3.1 Aspect Ratio for Stack Drilling
   3.2 Backup Material
   3.3 Bird Nesting
   3.4 Burr
   3.5 Chip Load
   3.6 Connector Array
   3.7 Cutting Speed
   3.8 Debris
   3.9 Debris Packing
   3.10 Drill Bit Wander
   3.11 Drill Construction
   3.12 Drilled Hole Size (DHS)
   3.13 Dwell Time
   3.14 Entry Material
   3.15 Feed Rate
   3.16 Finished Hole Size (FHS)
   3.17 Good Hole
   3.18 Misregistration
   3.19 Oil Canning
   3.20 Plowing
   3.21 Pressure Foot
   3.22 Pressure Foot Lead
   3.23 Pressure Foot Pressure
   3.24 Pressure Foot Vacuum Paths
   3.25 Retract Rate (RTR)
   3.26 Rifling
   3.27 Roughness
   3.28 Spindle Run-Out
   3.29 Spindle Speed
   3.30 Spindle Sweep
   3.31 Straight Drill
   3.32 Undercut Drill
   3.33 Z-Axis Offset
4 DRILL BITS
   4.1 Key Drill Bit Geometries
   4.2 Drill Bit Shank Diameter
   4.3 Drill Bit Inventory Control
   4.4 Drill Bit Inspection
   4.5 Drill Bit Replacement
   4.6 Drill Bit Cleaning
   4.7 Drill Bit Sharpening
   4.8 Ring Setting
5 TOOLING
   5.1 Tooling to Obtain Good Registration
   5.2 Tooling Plates and Bushings
   5.3 Types of Tooling
        5.3.1 Hard Tooling
        5.3.2 Soft Tooling
        5.3.3 Sliding Pins
   5.4 Tooling Holes
   5.5 Pin Inspection
   5.6 Pin/Tooling Hole Interference Fit
6 STACKING
   6.1 Stack Height
   6.2 Cleanliness
   6.3 Entry Material
   6.4 Backup Material
7 DRILLING MACHINE - SET-UP AND MAINTENANCE
   7.1 Preventive Maintenance
   7.2 Environment
   7.3 Alignment
   7.4 Stability
   7.5 Machine Performance Checks
        7.5.1 Machine Accuracy Tests
        7.5.2 Hole Locations
        7.5.3 RPM Fall-Off
        7.5.4 Vacuum
        7.5.5 Spindle Run-Out
        7.5.6 Pressure Foot Lead
        7.5.7 Pressure Foot Inserts
        7.5.8 Pressure Foot Pressure
8 DRILLING
   8.1 Materials
        8.1.1 Laminate Quality
        8.1.2 Cure
        8.1.3 Baking
        8.1.4 Reinforcement Materials
   8.2 Drilling Parameters
        8.2.1 Feed Rate
        8.2.2 Dwell Time
        8.2.3 Retract Rate (RTR)
        8.2.4 Peck Drilling
        8.2.5 Pulse Drilling
        8.2.6 Slot Drilling
        8.2.7 Hole Drilling Sequence
        8.2.8 Suggested Starting Conditions
        8.2.9 Factors Affecting Cutting Speed and Chip Load
   8.3 Drilling Depth into Backup Material
9 DRILLED HOLES
   9.1 Standard Hole Sizes
   9.2 Hole Location
        9.2.1 Hole Location Tolerance
        9.2.2 Outer Layer Annular Ring
        9.2.3 Minimum Inner Layer Annular Ring
        9.2.4 Minimum Dielectric Spacing
   9.3 Hole Quality
        9.3.1 Drilled Hole Diameter Tolerance
        9.3.2 Entry and Exit Burrs
        9.3.3 Roughness
        9.3.4 Resin Smear
        9.3.5 Circularity (Roundness)
        9.3.6 Straightness
        9.3.7 Perpendicularity
        9.3.8 Debris Packing
        9.3.9 Nail Heading
        9.3.10 Haloing
        9.3.11 Delamination
10 QUALITY ASSURANCE
   10.1 Drilling Capability Study
   10.2 Hole Location Evaluation
        10.2.1 First Article Inspection
        10.2.2 X-Ray Inspection
        10.2.3 Microsection Inspection
        10.2.4 Presence/Absence of Hole
   10.3 Hole Size Evaluation
   10.4 Hole Quality Evaluation
11 TROUBLE SHOOTING

Provides guidelines for generating good quality holes in printed circuit boards (PCBs) made from a wide variety of materials. Also describes the following topics: - Drill Bits; - Tooling; - Drilling Stacked Materials; - Drilling Machines; - Drilling Operation; - Drilled Hole Quality and Trouble Shooting.