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  • IPC 2524 : 0

    Current The latest, up-to-date edition.

    PWB FABRICATION DATA QUALITY RATING SYSTEM

    Available format(s):  Hardcopy

    Language(s):  English

    Published date:  01-01-2009

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 DATA CLASSIFICATION AND RATING
      2.1 Data Rating Level Categories
      2.2 General Requirements
    3 PACKAGE COMPLETENESS (LEVEL 1)
      3.1 Critical Problems
      3.2 Non-Critical Problems
    4 DATA QUALITY (LEVEL 2)
      4.1 Critical Problems
      4.2 Non-Critical Problems
    5 CONFORMANCE TO CUSTOMER DESIGN RULES (DRC) (LEVEL 3)
      5.1 Critical Problems
      5.2 Non-Critical Problems
    6 CONFORMANCE TO FABRICATOR DESIGN FULES (DFM) (LEVEL 4)
      6.1 Critical Problems
      6.2 Non-Critical Problems
    7 RATING SHEET

    Abstract - (Show below) - (Hide below)

    Describes a PWB fabrication data rating system used by fabricators to evaluate the incoming data package integrity. Deals with conformance to customers and manufacturer design rules.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 2517 : A SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ASSEMBLY IN-CIRCUIT TEST DATA DESCRIPTION
    IPC 2512 : A SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION
    IPC 2516 : A SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ASSEMBLED BOARD PRODUCT MANUFACTURING DATA DESCRIPTION
    PD IEC/PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
    IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
    IPC 2518 : A SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PARTS LIST PRODUCT MANUFACTURING DATA DESCRIPTION
    IEC PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    IPC 2514 : A SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION
    BS IEC 61182-2:2006 Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements
    IPC 2515 : A SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF BARE-BOARD PRODUCT TESTING DATA DESCRIPTION
    IPC 2513 : A SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DRAWING METHODS FOR MANUFACTURING DATA DESCRIPTION

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
    IPC 6011 : 0 GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC DR 570 : A GENERAL SPECIFICATION FOR 1/8 INCH DIAMETER SHANK CARBIDE DRILLS FOR PRINTED BOARDS
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC DR 572 : A DRILLING GUIDELINES FOR PRINTED BOARDS
    IPC M 106 : LATEST TECHNOLOGY REFERENCE FOR DESIGN MANUAL
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