IEC PAS 62647-1:2011
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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
NASA KSC DE 512-SM : 2012
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FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS |
EN 61189-5-1:2016
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
PD IEC/PAS 61249-8-5:2014
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Qualification and performance specification of permanent solder mask and flexible cover materials |
NASA STD 5005 : 2013
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STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT |
EN 50155:2017
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Railway applications - Rolling stock - Electronic equipment |
16/30282633 DC : 0
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BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK |
BS EN 50155:2017
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Railway applications. Rolling stock. Electronic equipment |
IEC 61189-5-1:2016
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
BS EN 61189-5-1:2016
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
IPC J STD 001 FRENCH : F
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 4554 CHINESE : -
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SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
IPC J STD 001 SWEDISH : E
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 RUSSIAN : E
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 TURKISH : E2010
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 POLISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 4553 : A
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SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
IPC 6202 : 0
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IPC/JPCA PERFORMANCE GUIDE MANUAL FOR SINGLE- AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING BOARDS |
IPC 6010 SERIES : LATEST
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IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
IPC DR 572 : A
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DRILLING GUIDELINES FOR PRINTED BOARDS |
IPC SM 840 : E
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QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
IPC J STD 001 HUNGARIAN : E
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC FLXCSP0605-CD : 2005
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IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE PACKAGING AND RADIO FREQUENCY IDENTIFICATION |
IPC J STD 001 GERMAN : F
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC FLXCSP0706-CD : 2006
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IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIP SCALE PACKAGING |
IPC SM 840 CHINESE : E
|
QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
IPC 4553 CHINESE : A
|
SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
IPC HDBK 840 : 0
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SOLDER MASK HANDBOOK |
IPC 4556 : 0
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SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS |
IPC J STD 001 ROMANIAN : F
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 DANISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 4554 : 0
|
SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
IEC TS 62647-1:2012
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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
I.S. EN 61189-5-1:2016
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
PD IEC/PAS 62647-1:2011
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Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
13/30295427 DC : 0
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BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
I.S. EN 50155:2017-11
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RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT |
PD IEC/TS 62647-1:2012
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Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
IEC PAS 61249-8-5:2014
|
Qualification and performance specification of permanent solder mask and flexible cover materials |
GEIA STD 0005-1 : 2012
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PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
IPC J STD 001 CHINESE : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IEC PAS 62293:2001
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Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
IPC J STD 001 SPANISH : F
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |