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IPC FC 231 : C1992 AMD 1 1995

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING

Superseded date

01-05-2002

Superseded by

IPC 4202 : A

Published date

12-01-2013

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Establishes the requirements for flexible base dielectric materials to be used in the fabrication of flexible printed wiring and flexible flat cable. The following topics are covered: base dielectrics; type of reinforcement; method of reinforcement and product classification.

DevelopmentNote
D99 (PROPOSAL) is an official representative proposal (draft only). (07/2002)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

IPC A 31 : LATEST FLEXIBLE RAW MATERIAL TEST PATTERN - FILM FORMAT
MIL-STD-2118 Base Document:1984 FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR
IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
MIL-STD-45662 Revision A:1988 CALIBRATION SYSTEMS REQUIREMENTS
IPC TM 650 : 0 TEST METHODS MANUAL
IPC PC 1990 : 1990 GENERAL REQUIREMENTS FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL
MIL-STD-414 Base Document:1957 SAMPLING PROCEDURE AND TABLE FOR INSPECTION BY VARIABLES FOR PERCENT DEFECTIVE
IPC FC 232 : C1994 AMD 1 1995 ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS
MIL-STD-202 Revision H:2015 ELECTRONIC AND ELECTRICAL COMPONENT PARTS
IPC FC 241 : C1992 AMD 1 1995 FLEXIBLE METAL CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED WIRING
MIL-STD-105 Revision E:1989 SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES
ASTM D 374 : 1999 Standard Test Methods for Thickness of Solid Electrical Insulation

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