• IPC FC 231 : C1992 AMD 1 1995

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING

    Available format(s): 

    Superseded date:  01-05-2002

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Establishes the requirements for flexible base dielectric materials to be used in the fabrication of flexible printed wiring and flexible flat cable. The following topics are covered: base dielectrics; type of reinforcement; method of reinforcement and product classification.

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    Development Note D99 (PROPOSAL) is an official representative proposal (draft only). (07/2002)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC A 31 : LATEST FLEXIBLE RAW MATERIAL TEST PATTERN - FILM FORMAT
    MIL-STD-2118 Base Document:1984 FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR
    IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
    IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
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