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IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE PACKAGING AND RADIO FREQUENCY IDENTIFICATION
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Superseded date: 01-08-2006
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Published date: 12-01-2013
Publisher: Institute of Printed Circuits
Highlights the integration of the three technologies - flexible circuitry, chip scale packaging and radio frequency identification, while continuing to stress the independent and critical parameters of each individual technology.
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