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  • IPC 4204 : A

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY

    Available format(s):  Hardcopy

    Superseded date:  22-02-2019

    Language(s): 

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS
    4 QUALITY ASSURANCE PROVISIONS
    5 PREPARATION FOR DELIVERY
    6 NOTES

    Abstract - (Show below) - (Hide below)

    Sets up the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed circuitry and flexible flat cable.

    General Product Information - (Show below) - (Hide below)

    Committee D-10
    Development Note Supersedes IPC FC 241. (06/2002) Included in IPC C 102. (06/2008) Included in IPC C 1000. (07/2008) Also available in Chinese Language, See IPC 4204 CHINESE. (02/2014)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC PAS 61249-3-1:2007 Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
    IPC 2223 CHINESE : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
    IPC CH 65 CHINESE : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    IPC 2223 GERMAN : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
    IPC FLXCSP0605-CD : 2005 IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE PACKAGING AND RADIO FREQUENCY IDENTIFICATION
    IPC FLXCSP0706-CD : 2006 IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIP SCALE PACKAGING
    IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
    DD IEC/PAS 61249-3-1:2007 Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
    BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
    EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    ISO/IEC 17025:2005 General requirements for the competence of testing and calibration laboratories
    IPC 4202 : A FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS
    IPC 4203 : A COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY
    IPC TM 650 : 0 TEST METHODS MANUAL
    ANSI/NCSL Z540 1 : 94(R2002) CALIBRATION - CALIBRATION LABORATORIES AND MEASURING AND TEST EQUIPMENT - GENERAL REQUIREMENTS
    ASTM D 2520 : 2013 Standard Test Methods for Complex Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials at Microwave Frequencies and Temperatures to 1650oC
    IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
    ISO 10012-1:1992 Quality assurance requirements for measuring equipment Part 1: Metrological confirmation system for measuring equipment
    IPC 9191 : 0 GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
    ASTM D 374 : 1999 Standard Test Methods for Thickness of Solid Electrical Insulation
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