IPC J STD 027 : 0

1. SCOPE
   1.1 Purpose
   1.2 Intent
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
  3.1 Recommended Mechanical Outline for Flip Chip Dice and
      Chip Size Packages
      3.1.1 Flip Chip Devices
      3.1.2 Chip Size Packages
      3.1.3 I/O Capability
  3.2 Interconnection Bump/Contact Attributes
      3.2.1 Functional Types
      3.2.2 Ball/Bump/Land Sizes
      3.2.3 Ball/Bump/Land Patterns
      3.2.4 I/O Drivers on the Periphery
      3.2.5 Isolating Sensitive I/Os
      3.2.6 Ball/Bump/Land Height Uniformity and Coplanarity
Annex A NORMATIVE TERMINOLOGY
Annex B ACRONYMS
Figures
Tables

Defines mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level.