IPC J STD 035 : 0

1 SCOPE
2 DEFINITIONS
  2.1 A-mode
  2.2 B-mode
  2.3 Back-Side Substrate View Area
  2.4 C-mode
  2.5 Through Transmission Mode
  2.6 Die Attach View Area
  2.7 Die Surface View Area
  2.8 Focal Length (FL)
  2.9 Focus Plane
  2.10 Leadframe (L/F) View Area
  2.11 Reflective Acoustic Microscope
  2.12 Through Transmission Acoustic Microscope
  2.13 Time-of-Flight (TOF)
  2.14 Top-Side Die Attach Substrate View Area
3 APPARATUS
  3.1 Reflective Acoustic Microscope System
  3.2 Through Transmission Acoustic Microscope System
4 PROCEDURE
  4.1 Equipment Setup
  4.2 Perform Acoustic Scans
Appendix A Acoustic Microscopy Defect Check Sheet
Appendix B Potential Image Pitfalls
Appendix C Some Limitations of Acoustic Microscopy
Appendix D Reference Procedure for Presenting Applicable
           Scanned Data

Specifies methods for performing acoustic microscopy on nonhermetic encapsulated electronic components. Gives to users with an acoustic microscopy process flow for detection of defects non-destructively in plastic packages, while achieving reproducibility.