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IPC L 108 : B

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS

Superseded date

01-03-1998

Superseded by

IPC 4101 : D

Published date

23-11-2012

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Covers the requirement for high-temperature, fully-cured, metal-clad, thin laminated plastic sheets, to be used primarily for high-temperature multilayered and thin printed boards for electrical and electronic circuits. This specification applies to sheets when the base laminate does not exceed 0.79mm (0.031 inch) in nominal thickness. Recognizes that printed boards are subject to classifications by intended end-item usage. Thus, where applicable, for ordering purposes the multilayer printed board laminate material is specified.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

RC.AERO 54407 : 1981 MATERIALS FOR SINGLE AND DOUBLE SIDED PRINTED CIRCUIT BOARDS
IPC ML 950 : C1980 RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR,
IPC D 949 : 1987 RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR,
IPC CC 110 : A 1997 GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS

IPC L 115 : B SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS
IPC L 112 : A92 SPECIFICATION FOR COMPOSITE METAL CLAD BASE MATERIALS FOR PRINTED BOARDS
IPC L 109 : B SPECIFICATION FOR RESIN PREIMPREGNATED FABRIC (PREPREG) FOR MULTILAYER PRINTED BOARDS

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