IPC S 804 : A1987
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
PRINTED WIRING BOARDS, SOLDERABILITY TEST METHODS FOR,
01-04-1992
12-01-2013
Provides a recommended test method which may be used by both vendor and user to determine solderability of printed wiring boards, with or without surface coatings, which will be soldered. The solderability determination is made to verify that the printed wiring fabrication processes and storage have had no adverse effect on the solderability of the printed wiring board. This is determined by evaluating the ability of those portions of the printed wiring board normally soldered to be wetted by the new cast of solder. Determination is judged by nondestructive methods.
| DevelopmentNote |
Supersedes IPC S 801 and IPC S 803. (04/2003)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| MIL P 13949 : G (1) SUPP 1 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| MIL-S-13949 Revision H:1993 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEGREES C) |
| LLL-R-626 Revision D:1984 | ROSINS: GUM, WOOD, AND TALL OIL |
| TT-I-735 Revision A:1963 | ISOPROPYL ALCOHOL |
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