IPC S 805 : 1985
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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PRINTED CIRCUITS - SOLDERABILITY TEST FOR COMPONENT LEADS AND TERMINATIONS,
Published date
12-01-2013
Publisher
Superseded date
01-10-1998
Superseded by
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Prescribes recommended test methods, defect definitions and illustrations for the solderability of component leads and terminations. It is intended to take into account original lead solderability of the component manufacturing process or subsequent burn in procedures. Intended to be used by both vendor and user for the determination of solderability.
| DocumentType |
Standard
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy |
| MIL-C-28809 Revision B:1988 | Circuit Card Assemblies, Rigid, Flexible, And Rigid Flex (No S/S Document) |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEG. C) (S/S BY J-STD-004, J-STD-005 AND J-STD-006) |
| LLL-R-626 Revision D:1984 | ROSINS: GUM, WOOD, AND TALL OIL (S/S BY A-A-59142) |
| TT-I-735 Revision A:1963 | Isopropyl Alcohol |
| MIL-STD-202 Revision H:2015 | Electronic and Electrical Component Parts |
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