IPC J STD 002 : D
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
24-06-2013
Publisher
Superseded date
23-08-2019
Excluding VAT
1 PREFACE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 TEST PROCEDURES
5 NOTES
APPENDIX A - Critical Component Surfaces
APPENDIX B - Evaluation Aids
APPENDIX C - Calculation of Maximum
Theoretical Force
APPENDIX D - Calculation of Integrated Value
of Area of the Wetting Curve
APPENDIX E - Informative Annex
APPENDIX F - J-STD-002/J-STD-003 Activated
Solderability Test Flux Rationale
Committee Letter
APPENDIX G - Graphical Representations:
Progression of Solder Wetting
Curve Parameters As Measured
By Wetting Balance Testing
APPENDIX H - Test Protocol for Wetting
Describes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs.
| Committee |
5-20
|
| DevelopmentNote |
Supersedes IPC S 805, EIA IS 49 & EIA 638. Included in IPC C 103 & IPC C 1000. Supersedes EIA 364-52. (07/2009) Also available in Chinese Language, See separate record J STD 002 CHINESE. (05/2016) Jointly Published by IPC, EIA and JEDEC. (07/2013) Supersedes EIA JESD 22-B102. (03/2016) Also available in Hardcopy format. (03/2018)
|
| DocumentType |
Standard
|
| Pages |
49
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| Supersedes |
| DSCC 06012 : A | RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (2.0 WATT), STYLE 2816 |
| DSCC 04006 : A | CAPACITORS, TANTALUM, HYBRID, HERMETICALLY SEALED |
| MIL-PRF-32535 Revision A:2017 | Capacitor, Chip, Fixed, Ceramic Dielectric (Temperature Stable and General Purpose), Extended Range, High Reliability and Standard Reliability, General Specification for |
| ASTM B 965 : 2009 | Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability |
| DSCC 06011 : C | RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (1.0 WATT), STYLE 2512 |
| IEC 60810:2017 | Lamps, light sources and LED packages for road vehicles - Performance requirements |
| I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| PD IEC/TS 62861:2017 | Guidelines for principal component reliability testing for LED light sources and LED luminaires |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| 14/30309696 DC : 0 | BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 60810 : 2018 | LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
| EN 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| MIL-DTL-83731 Revision E:2016 | Switches, Toggle, Unsealed and Sealed Toggle General Specification for |
| IPC TR 461 : 1979 | SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
| IPC TR 465 1 : 1993 | ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC TR 466 : 1995 | TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST |
| MIL STD 750-2 : A | MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES - PART 2: TEST METHODS 2001 THROUGH 2999 |
| MIL-PRF-8805 Revision G:2016 | Switches and Switch Assemblies, Sensitive, Snap Action (Basic, Limit, Push Button and Toggle Switches), General Specification for |
| IPC HDBK 005 : 0 | GUIDE TO SOLDER PASTE ASSESSMENT |
| MIL-PRF-83446-36 Revision B:2012 | Coils, Radio Frequency, Chip, Open Construction, Surface Mount, 0603 Size |
| MIL-DTL-3950 Revision K:2016 | Switches, Toggle, Environmentally Sealed, General Specification for |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| MIL-PRF-83446-37 Revision A:2011 | Coils, Radio Frequency, Chip, Open Construction, Surface Mount, 0805 Size |
| MIL-PRF-39010-15 Base Document:2013 | Coils, Radio Frequency, Open Construction, Ceramic Core, Fixed, Surface Mount Established Reliability and Non-Established Reliability (No S/S Document) |
| DSCC 06009 : A | RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.25 WATT), STYLE 1206 |
| DSCC 06010 : B | RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.5 WATT), STYLE 2010 |
| DSCC 15010 : A | CAPACITOR, TANTALUM, HYBRID, HERMETICALLY SEALED |
| BS EN 60810:2015 | Lamps for road vehicles. Performance requirements |
| DSCC 06007 : A | RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.1 WATT), STYLE 0603 |
| VDE 0468-2-69 : 2018 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| ASTM B 965 : 2009 : R2014 | Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability |
| PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| DSCC 04003 : E | CAPACITOR, TANTALUM, HYBRID, HERMETICALLY SEALED |
| DSCC 06008 : A | RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.125 WATT), STYLE 0805 |
| EN 60068-2-69:2017/AC:2018-03 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018) |
| I.S. EN 60810:2015 | LAMPS FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
| MIL-PRF-32560-2 Base Document:2016 | Coil, Radio Frequency, Chip, Fixed, Molded, Shielded Established Reliability, Surface Mount (No S/S Document) |
| MIL-PRF-32560-1 Base Document:2016 | Coil, Radio Frequency, Chip, Fixed, Conformal Coated, Established Reliability, Surface Mount (No S/S Document) |
| MIL-PRF-32560-6 Base Document:2016 | Coil, Radio Frequency, Chip, Fixed, Open Construction Established Reliability, Surface Mount, 0603 Size (No S/S Document) |
| DIN EN 60068-2-69 : 2007 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
| GEIA STD 0006 : 2008 | REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| IPC J STD 075 : 0 | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| MIL-PRF-39010-16 Base Document:2013 | Coils, Radio Frequency, Open Construction, Ferrite Core, Fixed, Surface Mount Established Reliability and Non-Established Reliability (No S/S Document) |
| SAE J2685_201412 | Positive Temperature Coefficient Overcurrent Protection Devices (PTCs) |
| IEC PAS 62686-2:2016 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components |
| I.S. EN 60068-2-69:2017 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| EN IEC 60810:2018 | Lamps, light sources and led packages for road vehicles - Performance requirements |
| BS EN IEC 60810:2018 | Lamps, light sources and led packages for road vehicles. Performance requirements |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC TS 62668-2:2016 | Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| 16/30350012 DC : 0 | BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
| PD IEC/PAS 62686-2:2016 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for passive components |
| IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
| IEC 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| BS EN 62435-5:2017 | Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
| PD IEC/TS 62668-2:2016 | Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| MIL-PRF-83421 Revision F:2017 | Capacitor, Fixed, Metallized Plastic Film Dielectric, (DC, AC, or DC and AC), Hermetically Sealed in Metal Cases or Ceramic Cases, Established Reliability, General Specification for |
| DSCC 04220G:2025 | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, FIELD PROGRAMMABLE GATE ARRAY, 1,000,000 GATES, MONOLITHIC SILICON |
| MIL-PRF-10304 Revision F:1999 | Meters, Electrical Indicating, Panel Type, Ruggedized, General Specification for |
| BS EN 60068-2-69:2017 | Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| SAE AS22759C | Wire, Electrical, Fluoropolymer-Insulated, Copper or Copper Alloy |
| SAE AS29606 | Wire, Electrical, Stranded, Uninsulated Copper, Copper Alloy, or Aluminum, or Thermocouple Extension, General Specification For |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| IEC TS 62861:2017 | Guidelines for principal component reliability testing for LED light sources and LED luminaires |
| MIL-PRF-20 Revision N:2017 | Capacitor, Fixed, Ceramic Dielectric (Temperature Compensating), Established Reliability and Non-Established Reliability, General Specification for |
| EN 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| MIL PRF 55365 : 0012 | CAPACITOR, FIXED, ELECTROLYTIC (TANTALUM), CHIP, ESTABLISHED RELIABILITY, NON-ESTABLISHED RELIABILITY, AND HIGH RELIABILITY, GENERAL SPECIFICATION FOR |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| SAE AS6324 | Verification of New Conductor Alloys for AS29606 Conductors Qualification |
| I.S. EN IEC 60810:2018 | LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
Summarise