IPC S 816 : 0

1.0 SCOPE
     1.1 Environmental, Safety, and Industrial
          Hygiene Considerations
     1.2 Applicable Documents
2.0 HANDLING
     2.1 Electrostatic Discharge (ESD) Concerns
     2.2 Component Leads
     2.3 Storage
     2.4 Interim Handling
3.0 INCOMING INSPECTION OF MATERIALS AND COMPONENTS
4.0 ADHESIVE APPLICATION
     4.1 Dispensing
5.0 SOLDER PASTE APPLICATION
     5.1 Stencil Printing
     5.2 Screen Printing
     5.3 Syringe Dispensing
6.0 COMPONENT PLACEMENT
     6.1 Observed Condition: Wrong Component
          Orientation
     6.2 Observed Condition: Wrong component placed on
          board
     6.3 Observed Condition: Missing Component
     6.4 Observed Condition: Component Misalignment
     6.5 Observed Condition: Damaged Component
7.0 INFRARED/CONVECTION REFLOW SOLDERING
     7.1 Observed Condition: No Reflow
     7.2 Observed Condition: Solder Balls
     7.3 Observed Condition: Charring of
          Board/Components
     7.4 Observed Condition: Damaged Components
     7.5 Observed Condition: Cracked Joints
     7.6 Observed Condition: Insufficient Solder
     7.7 Observed Condition: Bridging
     7.8 Observed Condition: Voids
     7.9 Observed Condition: Opens
     7.10 Observed Condition: Spatter
     7.11 Observed Condition: Component Alignment
     7.12 Observed Condition: Delamination
     7.13 Observed Condition: Warp
     7.14 Observed Condition: Disturbed Joints
     7.15 Observed Condition: Dewetting
8.0 VAPOR PHASE REFLOW SOLDERING
     8.1 General
     8.2 Problems
9.0 WAVE SOLDERING
     9.1 Observed Condition: Solder Skips
     9.2 Observed Condition: Solder Bridges
     9.3 Observed Condition: Unfilled Via Holes
     9.4 Observed Condition: Solder Wave Overflooding
          Board
     9.5 Observed Condition: Grainy or Disturbed Joints
     9.6 Observed Condition: Cold Joints
     9.7 Observed Condition: Solder Balls on Assembly
     9.8 Observed Condition: Cracked Chip Components or
          Plastic-Bodied Leaded Components
10.0 CLEANING
     10.1 Observed Condition: Visible Residue
     10.2 Observed Condition: Failure of Conformal
          Coating
11.0 REPAIR/REWORK
     11.1 Scope
     11.2 General
     11.3 Goals and Guidelines
     11.4 Primary Heating Methods
     11.5 Preheating and Auxiliary Heating
     11.6 Vision Systems and Component Placement
     11.7 Selecting Optimum Method of Rework/Repair
     11.8 Troubleshooting
     11.9 Observed Condition: Insufficient solder
          reflow to affect SMD removal
     11.10 Observed Condition: Component not
           removable after solder reflow or lifted lands
           upon attempted removal
     11.11 Observed Condition: Lands being lifted or
           damaged during removal of old solder
     11.12 Observed Condition: Insufficient or poor
           adhesion of solder on lands during
           pretinning operation
     11.13 Observed Condition: Misalignment of component
           to land pattern during SMD installation
     11.14 Observed Condition: Dispersion or solderballing
           of solder paste during reflow
     11.15 Observed Condition: Blistering or measling
           of substrate, or lifted lands during SMD
           installation or removal

Provides guidelines and assistance in performing and troubleshooting the steps involved in the process of producing printed wiring assemblies incorporating surface mounting attachment of components.