• IPC SC 60 : A

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    POST SOLDER SOLVENT CLEANING HANDBOOK

    Available format(s):  Hardcopy

    Superseded date:  01-07-2011

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
      1.1 Purpose
      1.2 Terms and Definitions
    2 APPLICABLE DOCUMENTS
      2.1 Industry Standards
      2.2 U.S. Federal Regulations
      2.3 Other
    3 CLEANING SOLVENTS/SOLUTIONS
      3.1 Effectiveness
      3.2 Stability
      3.3 Safety
      3.4 Environmental
      3.5 Cost
      3.6 Summary
    4 PROPERTIES OF CLEANING SOLVENTS
      4.1 Introduction
      4.2 Physical Properties
      4.3 Solvency
      4.4 Polymer and Marking Compatibility
      4.5 Metals Compatibility and Solvent Stability
    5 MANUFACTURING RESIDUES
      5.1 Introduction
      5.2 Solvent Classifications and Characteristics
      5.3 Summary
    6 CLEANING AFTER AUTOMATED SOLDERING
      6.1 Introduction
      6.2 Batch Vapor Cleaning
      6.3 Conveyorized Spray Cleaning
      6.4 Ultrasonics
      6.5 Cold Cleaning Equipment
      6.6 Soak Tanks
      6.7 Wave Cleaning
      6.8 Brush Cleaning
      6.9 Equipment Retrofitting (Upgrading)
    7 CLEANING AFTER MANUAL SOLDERING
      7.1 Introduction
      7.2 Cleaning Required
      7.3 Cleaning Methods
      7.4 Cleaning Protocol
    8 PROCESS CONTROL
      8.1 Introduction
      8.2 Equipment Options and Recommendations
      8.3 Equipment Location and Operation
      8.4 Maintaining the Cleaning System
      8.5 Proper Still Practices
      8.6 Solvent Monitoring
    9 ENVIRONMENTAL CONSIDERATIONS
      9.1 Introduction
      9.2 The Clean Air Act
      9.3 The Clean Water Act
      9.4 RCRA - General
      9.5 Superfund - General
      9.6 Toxic Release Inventory Reporting Requirements
      9.7 Influencing the Regulatory Process
      9.8 Applicability
    ANNEX A TABLES OF FORMULATED CLEANING SOLVENTS
    ANNEX B TABLE OF FORMULATED CLEANING SOLVENT SUPPLIERS
    ANNEX C EPA POSITION ON NORMAL PROPYL BROMIDE
    Tables

    Abstract - (Show below) - (Hide below)

    Describes the following key areas of concern when selecting cleaning solvents/solutions: effectiveness; stability; safety and cost. Other specific topics covered are: properties of cleaning solvents; manufacturing residues; cleaning equipment and processes; cleaning of printed circuit assemblies after hand solder operations; process control; environmental conditions.

    General Product Information - (Show below) - (Hide below)

    Development Note Also available in CD-ROM format. Included in IPC C 108. (06/2008) Included in IPC C 1000. (08/2008)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 7526 : 2007 STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK
    IPC HDBK 840 : 0 SOLDER MASK HANDBOOK
    IPC SA 61 : A POST SOLDER SEMI-AQUEOUS CLEANING HANDBOOK
    IPC TR 582 : 0 CLEANING AND CLEANLINESS TESTING PROGRAM FOR PHASE 3 - LOW SOLIDS, FLUXES AND PASTES PROCESSED IN AMBIENT AIR
    IPC M 108 : LATEST CLEANING GUIDES AND HANDBOOKS MANUAL
    IPC TR 581 : 1994 IPC PHASE 3 CONTROLLED ATMOSPHERE SOLDERING STUDY
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