IPC SC 60 : A

1 SCOPE
  1.1 Purpose
  1.2 Terms and Definitions
2 APPLICABLE DOCUMENTS
  2.1 Industry Standards
  2.2 U.S. Federal Regulations
  2.3 Other
3 CLEANING SOLVENTS/SOLUTIONS
  3.1 Effectiveness
  3.2 Stability
  3.3 Safety
  3.4 Environmental
  3.5 Cost
  3.6 Summary
4 PROPERTIES OF CLEANING SOLVENTS
  4.1 Introduction
  4.2 Physical Properties
  4.3 Solvency
  4.4 Polymer and Marking Compatibility
  4.5 Metals Compatibility and Solvent Stability
5 MANUFACTURING RESIDUES
  5.1 Introduction
  5.2 Solvent Classifications and Characteristics
  5.3 Summary
6 CLEANING AFTER AUTOMATED SOLDERING
  6.1 Introduction
  6.2 Batch Vapor Cleaning
  6.3 Conveyorized Spray Cleaning
  6.4 Ultrasonics
  6.5 Cold Cleaning Equipment
  6.6 Soak Tanks
  6.7 Wave Cleaning
  6.8 Brush Cleaning
  6.9 Equipment Retrofitting (Upgrading)
7 CLEANING AFTER MANUAL SOLDERING
  7.1 Introduction
  7.2 Cleaning Required
  7.3 Cleaning Methods
  7.4 Cleaning Protocol
8 PROCESS CONTROL
  8.1 Introduction
  8.2 Equipment Options and Recommendations
  8.3 Equipment Location and Operation
  8.4 Maintaining the Cleaning System
  8.5 Proper Still Practices
  8.6 Solvent Monitoring
9 ENVIRONMENTAL CONSIDERATIONS
  9.1 Introduction
  9.2 The Clean Air Act
  9.3 The Clean Water Act
  9.4 RCRA - General
  9.5 Superfund - General
  9.6 Toxic Release Inventory Reporting Requirements
  9.7 Influencing the Regulatory Process
  9.8 Applicability
ANNEX A TABLES OF FORMULATED CLEANING SOLVENTS
ANNEX B TABLE OF FORMULATED CLEANING SOLVENT SUPPLIERS
ANNEX C EPA POSITION ON NORMAL PROPYL BROMIDE
Tables

Describes the following key areas of concern when selecting cleaning solvents/solutions: effectiveness; stability; safety and cost. Other specific topics covered are: properties of cleaning solvents; manufacturing residues; cleaning equipment and processes; cleaning of printed circuit assemblies after hand solder operations; process control; environmental conditions.