IPC CF 148 : A1998
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
RESIN COATED METAL FOR PRINTED BOARDS
English
12-01-2013
01-02-2008
1 SCOPE
1.1 Classification
1.2 Quality/Performance Classification
1.3 Presentation
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 National Conference of Standards Laboratories
2.3 International Standards
3 REQUIREMENTS
3.1 Terms and Definitions
3.2 Specification Sheets
3.3 Qualification Testing
3.4 Verification of Manufacturer's Quality System
3.5 Precedence
3.6 Materials
3.7 General Acceptability Requirements
4 GENERAL REQUIREMENTS
4.1 Visual Properties
4.2 Dimensional
4.3 Processing Requirements
4.4 Physical Requirements
4.5 Chemical Requirements
4.6 Electrical Requirements
4.7 Environmental Requirements
4.8 Workmanship
4.9 Marking
4.10 Material Safety
5 QUALITY ASSURANCE PROVISIONS
5.1 Quality System
5.2 Responsibility for Inspection
5.3 Qualification Testing
5.4 Quality Conformance Inspection
5.5 Statistical Process Control (SPC)
6 PREPARATION FOR DELIVERY
6.1 Packaging Materials
6.2 Authorized Distributors
7 NOTES
7.1 Ordering Information for Resin
7.2 New Materials
Establishes the requirements for metal foils coated with a resin or composite of resins on one side that are to be used for the fabrication of printed boards. An identification system is defined that describes the product with respect to: metal foil type; metal foil thickness; resin type; resin material thickness; end-of-item use classification.
| DevelopmentNote |
Included in Manuals IPC S 100, IPC M 107, the IPC HDI 1 Compendium & the IPC E 500 Collection. (09/2003) Also available in CD-ROM format. (09/2005)
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| DocumentType |
Standard
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| Pages |
27
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| IPC M 107 : LATEST | STANDARDS FOR PRINTED BOARD MATERIALS MANUAL |
| IPC L 112 : A92 | SPECIFICATION FOR COMPOSITE METAL CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC M 107 : LATEST | STANDARDS FOR PRINTED BOARD MATERIALS MANUAL |
| IPC TR 485 : 1985 | RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY |
| IPC TR 484 : 1986 | RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
| IPC CF 152 : B | COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS |