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IPC TR 579 : 0

Current

Current

The latest, up-to-date edition.

ROUND ROBIN RELIABILITY EVALUATION OF SMALL DIAMETER PLATED-THROUGH HOLES IN PWBS

Published date

01-09-1988

Approximately 200,000 PTHs covering primarily electroplated but also electroless technology were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated.

DevelopmentNote
Included in IPC C 105 & IPC C 1000. (08/2008)
DocumentType
Technical Report
PublisherName
Institute of Printed Circuits
Status
Current

IPC A 39 : 1988 SMALL HOLE RELIABILITY ROUND ROBIN ARTWORK
IPC TR 578 : 1984 LEADING EDGE MANUFACTURING TECHNOLOGY REPORT

IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
IPC M 105 : LATEST RIGID PRINTED BOARD MANUAL
IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC SM 785 : 0 GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS

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