• IPC TR 579 : 0

    Current The latest, up-to-date edition.

    ROUND ROBIN RELIABILITY EVALUATION OF SMALL DIAMETER PLATED-THROUGH HOLES IN PWBS

    Available format(s): 

    Language(s): 

    Published date:  01-09-1988

    Publisher:  Institute of Printed Circuits

    Sorry this product is not available in your region.

    Add To Cart

    Abstract - (Show below) - (Hide below)

    Approximately 200,000 PTHs covering primarily electroplated but also electroless technology were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in IPC C 105 & IPC C 1000. (08/2008)
    Document Type Technical Report
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC A 39 : 1988 SMALL HOLE RELIABILITY ROUND ROBIN ARTWORK
    IPC TR 578 : 1984 LEADING EDGE MANUFACTURING TECHNOLOGY REPORT

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
    IPC M 105 : LATEST RIGID PRINTED BOARD MANUAL
    IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
    IPC SM 785 : 0 GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS
    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective