IPC SM 785 : 0

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Current The latest, up-to-date edition.

GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS

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Published date: 01-11-1992

Publisher: Institute of Printed Circuits

Table of Contents - (Show below) - (Hide below)

1.0 SCOPE
     1.1 Purpose
     1.2 Document Organization
2.0 APPLICABLE DOCUMENTS
     2.1 IPC
     2.2 Joint Industry Standards
     2.3 Military
     2.4 Other Publications
3.0 REQUIREMENTS
     3.1 Terms and Definitions
     3.2 Reliability Concepts and Understanding
     3.3 Reliability Assurance
     3.4 Damage/Failure Mechanisms
     3.5 Application Considerations
4.0 SURFACE MOUNT SOLDER ATTACHMENT FATIGUE BEHAVIOR
     AND RELIABILITY PREDICTION
     4.1 General Fatigue Life Models
     4.2 Solder Joint Fatigue
     4.3 Fatigue Behavior of Solder Joints
     4.4 Acceleration Factors/Acceleration Transform
     4.5 Statistical Considerations
5.0 DESIGN FOR SOLDER ATTACHMENT RELIABILITY
     5.1 Primary Design Parameters
     5.2 Secondary Design Parameters
6.0 MANUFACTURE/PROCESSES
     6.1 Process Control and Verification
     6.2 Consequences of Defects
     6.3 Material Properties
7.0 ACCELERATED RELIABILITY TESTING
     7.1 Reliability Program/Strategy
     7.2 Generic Damage Mechanism Investigations
     7.3 Thermal Cycling
     7.4 Mechanical Cycling
     7.5 Vibration
     7.6 Creep Rupture Tests
     7.7 Mechanical Shock Testing
     7.8 Failure Criteria for Solder Joint Fatigue
          Tests
     7.9 Accelerated Life Test Planning
     7.10 Failure Mode Analysis
     7.11 Reporting Results
Appendix A Step-by-Step Example
Appendix B References
Appendix C Bibliography
Figures
Tables

Abstract - (Show below) - (Hide below)

Provides guidelines for accelerated reliability testing of surface mount solder attachments for evaluating and extrapolating the results of these accelerated reliability tests towards actual use environments of electronic assemblies.

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Development Note	Included in IPC C 103 & IPC C 1000. (08/2008)
Document Type	Standard
ISBN
Pages
Published
Publisher	Institute of Printed Circuits
Status	Current

Standards Referenced By This Book - (Show below) - (Hide below)

IPC AJ 820 : A	ASSEMBLY AND JOINING HANDBOOK
IPC J STD 001 SWEDISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 DANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 RUSSIAN : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 SPANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 TURKISH : E2010	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 POLISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 ROMANIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 2221 GERMAN : B	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 7092 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
IPC A 610 CZECH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 7093 CHINESE : -	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IPC A 610 GERMAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HINDI : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ESTONIAN : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 POLISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 DUTCH : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 KOREAN : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ITALIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 FRENCH : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 HUNGARIAN : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 GERMAN : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 SWEDISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HUNGARIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 7351 GERMAN : B	Basic requirements for SMT design and SMD patch guideline
IPC A 610 CHINESE : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 TURKISH : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 ROMANIAN : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 JAPANESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 DANISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 RUSSIAN : D	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 VIETNAMESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IEC PAS 62647-3:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
IPC 7351 : B	GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IPC J STD 001 CHINESE : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 SPANISH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 7093 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IEC TS 62647-3:2014	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
GEIA STD 0005-3 : 2013	PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES
GEIA SSB 1.003 : 2002	ACCELERATION FACTORS
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IPC 9701 : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC TR 578 : 1984	LEADING EDGE MANUFACTURING TECHNOLOGY REPORT
PD IEC/TS 62647-3:2014	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Performance testing for systems containing lead-free solder and finishes
IPC 9701 CHINESE : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
GEIA SSB 1 : 2000	GUIDELINES FOR USING PLASTIC ENCAPSULATED MICROCIRCUITS AND SEMICONDUCTORS IN MILITARY, AEROSPACE AND OTHER RUGGED APPLICATIONS
DD IEC PAS 62647-3 : DRAFT SEP 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
IPC TR 579 : 0	ROUND ROBIN RELIABILITY EVALUATION OF SMALL DIAMETER PLATED-THROUGH HOLES IN PWBS
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012	GENERIC STANDARD ON PRINTED BOARD DESIGN

Standards Referencing This Book - (Show below) - (Hide below)

IPC D 279 : 0	DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC 9701 : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC M 103 : LATEST	STANDARDS FOR SURFACE MOUNT ASSEMBLIES MANUAL

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