IPC TR 585 : 0

1 PURPOSE
2 INTRODUCTION
3 TASK OBJECTIVES
4 TEST PLAN
5 SAMPLE PREPARATION
6 SURFACE ANALYSIS OF SAMPLES
7 SAMPLE CONDITIONING (COUPON CONDITIONING)
8 SAMPLE TESTING
   8.1 Wetting Balance Testing
   8.2 Sequential Electrochemical Reduction Analysis
        (SERA) Testing
   8.3 Dip and Look Testing
   8.4 Wetting Balance Testing
   8.5 SERA Testing
9 DATA ANALYSIS
   9.1 Wetting Balance Results
   9.2 Visual
10 CONCLUSIONS
   10.1 Conclusions By Finish
        10.1.1 Bare Copper
        10.1.2 RTL
        10.1.3 Immersion Silver
        10.1.4 Immersion Tin
        10.1.5 Electroless Nickel/Immersion Gold (ENIG)
        10.1.6 OSP
   10.2 Investigation Confirmation Testing
11 RECOMMENDATIONS
Appendix 1: Coupon Numbering System
Appendix 2 A: Charts for Reflowed Tin Lead
Appendix 2 B: Charts for Bare Copper
Appendix 2 C: Charts for Immersion Silver
Appendix 2 D: Charts for Immersion Tin
Appendix 2 E: Charts for Nickel Gold
Appendix 2 F: Charts for OSP
Appendix 3: Pareto Chart Analysis
Appendix 4: 'Stop Light' Analyses of Wetting
            Balance Data
Appendix 5: Relative Stoplight and Box-and-Whisker
            Analysis of SERA Data
Appendix 6: Solderability Visual Exam
Appendix 7: Statement of Work for This Project at
            the Start
Appendix 8: IPC Dip and Look Test Method
Appendix 9: Further Analysis of the Alternate Final
            Finishes Task Group Report on Time,
            Temperature and Humidity Stress of Final
            Board Finish Solderability

Describes the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes.