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JIS C 6481:1996

Current

Current

The latest, up-to-date edition.

Test methods of copper-clad laminates for printed wiring boards

Available format(s)

Hardcopy , PDF

Language(s)

English, Japanese

Published date

31-01-1996

€73.67
Excluding VAT

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This Japanese Industrial Standard specifies test methods of copper-clad laminates for printed wiring boards (hereafter referred to as "copper-clad laminates").

DocumentType
Test Method
Pages
52
PublisherName
Japanese Standards Association
Status
Current

Reaffirmed 2015 96(R2015) [20/10/2015]96(R2010) [01/10/2010]96(R2001) [20/09/2001]96 [01/01/1996]90 [01/10/1990]86

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JIS C 6482:1997 Copper-clad laminates for printed wiring boards - Paper base, epoxy resin
JIS C 6489:1999 Base materials for printed circuits -- Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6488:1999 Base materials for printed circuits - Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)
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JIS C 6485:1997 Copper-clad laminates for printed wiring boards - Paper base, phenolic resin
JIS C 6480:1994 General rules of copper-clad laminates for printed wiring boards
JIS C 6493:1999 Base materials for printed circuits - Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
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JIS C 6494:1999 Base materials for printed circuits - Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
JIS C 6490:1998 Base materials for printed circuits - Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6492:1998 Base materials for printed circuits - Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6485:2008 Base materials for printed circuits - Paper base, phenolic resin
JIS C 6486:1996 Thin copper-clad laminates for multilayer printed wiring boards - Glass fabric base, epoxy resin
JIS C 6484:2005 Base materials for printed circuits - Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test)
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JIS C 62024-1:2006 High Frequency Inductive Components - Electrical Characteristics And Measuring Methods - Part 1: Nanohenry Range Chip Inductor
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