JIS Z 3284:1994
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Solder paste
English
31-03-1994
20-06-2014
JIS Z 3284-4:2014
JIS Z 3284-3:2014
JIS Z 3284-1:2014
JIS Z 3284-2:2014
This Japanese Industrial Standard specifies the solder paste to be used in the wiring connection of electrical equipments, electronic equipments, communication equipment or the like, and in manufacturing the parts thereof.
| DocumentType |
Standard
|
| Pages |
47
|
| PublisherName |
Japanese Standards Association
|
| Status |
Superseded
|
| SupersededBy |
Reaffirmed 2010
| JIS H 3100:2006 | Copper and copper alloy sheets, plates and strips |
| JIS Z 3282:2006 | Soft solders -- Chemical compositions and forms |
| JIS Z 3197:1999 | Testing methods for soldering fluxes |
| JIS C 6480:1994 | General rules of copper-clad laminates for printed wiring boards |
| JIS Z 3197:1999 | Testing methods for soldering fluxes |
| JIS Z 3198-6:2003 | Test methods for lead-free solders -- Part 6: Methods for 45°pull test of solder joints on QFP lead Part 6: Methods for 45°pull test of solder joints on QFP lead |
| JIS Z 3282:2006 | Soft solders -- Chemical compositions and forms |
| JIS C 0099:2005 | Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste |
| JIS Z 3198-3:2003 | Test methods for lead-free solders -- Part 3: Methods for spread test Part 3: Methods for spread test |
| JIS Z 3198-7:2003 | Test methods for lead-free solders -- Part 7: Methods for shear strength of solder joints on chip components |
| JIS C 61191-1:2006 | Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
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