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JIS Z 3284:1994

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Solder paste

Available format(s)

PDF

Language(s)

English

Published date

31-03-1994

Superseded date

20-06-2014

€43.42
Excluding VAT

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This Japanese Industrial Standard specifies the solder paste to be used in the wiring connection of electrical equipments, electronic equipments, communication equipment or the like, and in manufacturing the parts thereof.

DocumentType
Standard
Pages
47
PublisherName
Japanese Standards Association
Status
Superseded
SupersededBy

Reaffirmed 2010

JIS H 3100:2006 Copper and copper alloy sheets, plates and strips
JIS Z 3282:2006 Soft solders -- Chemical compositions and forms
JIS Z 3197:1999 Testing methods for soldering fluxes
JIS C 6480:1994 General rules of copper-clad laminates for printed wiring boards

JIS Z 3197:1999 Testing methods for soldering fluxes
JIS Z 3198-6:2003 Test methods for lead-free solders -- Part 6: Methods for 45°pull test of solder joints on QFP lead Part 6: Methods for 45°pull test of solder joints on QFP lead
JIS Z 3282:2006 Soft solders -- Chemical compositions and forms
JIS C 0099:2005 Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
JIS Z 3198-3:2003 Test methods for lead-free solders -- Part 3: Methods for spread test Part 3: Methods for spread test
JIS Z 3198-7:2003 Test methods for lead-free solders -- Part 7: Methods for shear strength of solder joints on chip components
JIS C 61191-1:2006 Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

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€43.42
Excluding VAT