JIS Z 3284:1994
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
Solder paste
Hardcopy , PDF
20-06-2014
JIS Z 3284-4:2014
JIS Z 3284-3:2014
JIS Z 3284-1:2014
JIS Z 3284-2:2014
English, Japanese
15-02-2008
Important note : Users cannot be edited or removed once added to your Multi user PDF.
This Japanese Industrial Standard specifies the solder paste to be used in the wiring connection of electrical equipments, electronic equipments, communication equipment or the like, and in manufacturing the parts thereof.
| DocumentType |
Standard
|
| Pages |
47
|
| PublisherName |
Japanese Standards Association
|
| Status |
Withdrawn
|
| SupersededBy |
Reaffirmed 2010
| JIS H 3100:2006 | Copper and copper alloy sheets, plates and strips |
| JIS Z 3282:2006 | Soft solders - Chemical compositions and forms |
| JIS Z 3197:1999 | Testing methods for soldering fluxes |
| JIS C 6480:1994 | General rules of copper-clad laminates for printed wiring boards |
| JIS Z 3197:1999 | Testing methods for soldering fluxes |
| JIS Z 3198-6:2003 | Test methods for lead-free solders Part 6: Methods for 45°pull test of solder joints on QFP lead |
| JIS Z 3282:2006 | Soft solders - Chemical compositions and forms |
| JIS C 0099:2005 | Environmental testing: Tests - Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste |
| JIS Z 3198-3:2003 | Test methods for lead-free solders Part 3: Methods for spread test |
| JIS Z 3198-7:2003 | Test methods for lead-free solders -- Part 7: Methods for shear strength of solder joints on chip components Part 7: Methods for shear strength of solder joints on chip components |
| JIS C 61191-1:2006 | Printed Board Assemblies - Part 1: Generic Specification - Requirements For Soldered Electrical And Electronic Assemblies Using Surface Mount And Related Assembly Technologies |
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