NBN EN 61191-3 : 1999
Current
The latest, up-to-date edition.
PRINTPLAATSAMENSTELLINGEN - GROEPSSPECIFICATIE - EISEN VOOR DOOR GATEN GESTOKEN, GESOLDEERDE SAMENSTELLINGEN
12-01-2013
Contents
Clause
1. General
1.1 Scope
1.2 Classification
2. Normative references
3. Through-hole technology (THT)
4. Through-hole mounting of components
4.1 Placement accuracy
4.2 Through-hole component requirements
5. Acceptance requirements
5.1 Control and corrective actions
5.2 Through-hole component lead soldering
6. Rework of unsatisfactory solder connections
Annex A (normative) Placement requirements for through-hole
mount devices
Annex ZA Normative references to international publications
with their corresponding European publications
Gives requirements for lead and hole solder assembly. These pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that also include other relating technologies (i.e. chip mounting, surface mount, terminal mounting)
| DocumentType |
Standard
|
| PublisherName |
Belgian Standards
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 61191-3:2016-01 (Draft) | Identical |
| BS EN 61191-3:2017 | Identical |
| EN 61191-3:2017 | Identical |
| I.S. EN 61191-3:2017 | Identical |
| NF EN 61191-3 : 2000 | Identical |
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