BS EN 61191-3:2017
Current
The latest, up-to-date edition.
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Hardcopy , PDF
English
25-09-2017
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Through-hole mounting of components
6 Acceptance requirements
7 Rework of unsatisfactory solder connections
Annex A (normative) - Placement requirements for
through-hole mount devices
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines requirements for lead and hole solder assemblies.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 93/206813 DC (11/2005) Supersedes 15/30330490 DC. (10/2017)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
| Standards | Relationship |
| DIN EN 61191-3:2016-01 (Draft) | Identical |
| NBN EN 61191-3 : 1999 | Identical |
| EN 61191-3:2017 | Identical |
| I.S. EN 61191-3:2017 | Identical |
| IEC 61191-3:2017 | Identical |
| NF EN 61191-3 : 2000 | Identical |
| UNE-EN 61191-3:2017 | Equivalent |
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