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IEC 61193-3:2013
|
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
|
IEC 61193-1:2001
|
QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES |
|
IEC 61188-5-3:2007
|
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides |
|
IEC 61188-5-2:2003
|
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
|
IEC 60068-2-58:2015+AMD1:2017 CSV
|
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
|
IEC 60068-2-20:2008
|
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
|
IEC PAS 62326-7-1:2007
|
Performance guide for single- and double-sided flexible printed wiring boards |
|
J STD 001 : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
|
IEC 61190-1-2:2014
|
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
|
IEC 62326-1:2002
|
Printed boards - Part 1: Generic specification |
|
J STD 006 : C
|
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
|
J STD 004 : B
|
REQUIREMENTS FOR SOLDERING FLUXES |
|
IPC TM 650 : 0
|
TEST METHODS MANUAL |
|
IEC 62326-4:1996
|
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
|
IPC A 610 : F
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
J STD 005 : A
|
REQUIREMENTS FOR SOLDERING PASTES |
|
J STD 002 : D
|
SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
|
IEC 61188-7:2017
|
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction |
|
IEC 61191-1:2013
|
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
|
IEC 61188-5-6:2003
|
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
|
IEC 61188-5-1:2002
|
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
|
IEC 60194:2015
|
Printed board design, manufacture and assembly - Terms and definitions |
|
IEC 61188-5-5:2007
|
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
|
ISO 9001:2015
|
Quality management systems Requirements |
|
IEC 62326-4-1:1996
|
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C |
|
IPC OI 645 : 0
|
STANDARD FOR VISUAL OPTICAL INSPECTION AIDS |
|
EN 61191-1 : 2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
|
IEC 61188-5-4:2007
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
|
J STD 003 : C
|
SOLDERABILITY TESTS FOR PRINTED BOARDS |
|
IPC SM 817 : A
|
GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES |
|
J STD 020 : D-1
|
MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
|
IEC 61189-2:2006
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
|
IPC 9191 : 0
|
GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |