I.S. EN 61191-3:2017
Current
The latest, up-to-date edition.
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
Hardcopy , PDF
English
01-01-2017
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Through-hole mounting of components
6 Acceptance requirements
7 Rework of unsatisfactory solder connections
Annex A (normative) - Placement requirements for
through-hole mount devices
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines requirements for lead and hole solder assemblies.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
34
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 61191-3:2016-01 (Draft) | Identical |
| NBN EN 61191-3 : 1999 | Identical |
| EN 61191-3:2017 | Identical |
| IEC 61191-3:2017 | Identical |
| NF EN 61191-3 : 2000 | Identical |
| BS EN 61191-3:2017 | Identical |
| UNE-EN 61191-3:2017 | Equivalent |
| IEC 61191-3:2017 | Equivalent |
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