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  • NBN EN 61191-3 : 1999

    Current The latest, up-to-date edition.

    PRINTPLAATSAMENSTELLINGEN - GROEPSSPECIFICATIE - EISEN VOOR DOOR GATEN GESTOKEN, GESOLDEERDE SAMENSTELLINGEN

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    Published date:  12-01-2013

    Publisher:  Belgian Standards

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    Table of Contents - (Show below) - (Hide below)

    Contents
    Clause
    1. General
        1.1 Scope
        1.2 Classification
    2. Normative references
    3. Through-hole technology (THT)
    4. Through-hole mounting of components
        4.1 Placement accuracy
        4.2 Through-hole component requirements
    5. Acceptance requirements
        5.1 Control and corrective actions
        5.2 Through-hole component lead soldering
    6. Rework of unsatisfactory solder connections
    Annex A (normative) Placement requirements for through-hole
    mount devices
    Annex ZA Normative references to international publications
    with their corresponding European publications

    Abstract - (Show below) - (Hide below)

    Gives requirements for lead and hole solder assembly. These pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that also include other relating technologies (i.e. chip mounting, surface mount, terminal mounting)

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    Document Type Standard
    Publisher Belgian Standards
    Status Current
    View more information

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