NF EN 60191-6-1 : 2002
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GULL-WING LEAD TERMINALS
12-01-2013
1 Scope
2 Normative references
3 Definitions
4 References and drawings
5 Outline dimensions
6 Package height and stand-off height
7 Terminal thickness and width
8 Terminal shape
9 Tolerance of terminal center position and coplanarity
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications
Provides the requirements for the design rule of terminal shape plastic packages with gull-wing leads; QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4.
| DevelopmentNote |
Indice de classement: C96-013-6-1PR. PR NF EN 60191 6-1 March 2002. (09/2002) PR NF EN 60191-6-1 September 2011. (09/2011)
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| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
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| Status |
Current
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| Standards | Relationship |
| BS EN 60191-6-1:2001 | Identical |
| IEC 60191-6-1:2001 | Identical |
| UNE-EN 60191-6-1:2002 | Identical |
| EN 60191-6-1:2001 | Identical |
| DIN EN 60191-6-1:2002-08 | Identical |
| I.S. EN 60191-6-1:2002 | Identical |
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