NF EN 60191-6-5 : 2002
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-5: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)
12-01-2013
1 Scope
2 Normative references
3 Definitions
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The aim of this design guide is to standardize outlines and secure interchangeability of FBGA packages.
| DevelopmentNote |
Indice de Classement: C96-013-6-5PR. (09/2002) PR NF EN 60191-6-5 January 2011. (02/2011)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
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| Status |
Current
|
| Standards | Relationship |
| BS EN 60191-6-5:2001 | Identical |
| UNE-EN 60191-6-5:2002 | Identical |
| IEC 60191-6-5:2001 | Identical |
| DIN EN 60191-6-5:2002-05 | Identical |
| I.S. EN 60191-6-5:2002 | Identical |
| EN 60191-6-5:2001 | Identical |
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