NF EN 61190-1-1 : 2002

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Current The latest, up-to-date edition.

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY

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Published date: 12-01-2013

Publisher: Association Francaise de Normalisation

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AVANT-PROPOS
INTRODUCTION
1 Domaine d'application et objet
2 Références normatives
3 Termes et définitions
4 Exigences
  4.1 Contradiction
  4.2 Classification et essais des flux
5 Dispositions relatives à l'assurance qualité
  5.1 Responsabilité du controle
  5.2 Classification des controles
  5.3 Controle des matériaux
  5.4 Controle de qualification
  5.5 Controle de performance
  5.6 Assurance qualité
  5.7 Préparation des flux pour essai
6 Préparation pour livraison
  6.1 Boîtier de conservation et emballage
7 Informations supplémentaires
  7.1 Activité de flux
  7.2 Relation entre flux et nettoyage
  7.3 Données de commande
Annexe A (normative)
Annexe ZA (normative) - Références normatives à d'autres
                        publications internationales avec
                        les publications européennes
                        correspondantes
Bibliographie

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Describes general requirements for the classifications and testing of soldering fluxes for high-quality interconnections in electronics assembly.

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Development Note	Indice de Classement: C90-700-1-1 PR NF EN 61190 1-1 September 2000 (11/2002)
Document Type	Standard
ISBN
Pages
Published
Publisher	Association Francaise de Normalisation
Status	Current

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
DIN EN 61190-1-1:2003-01	Identical
EN 61190-1-1:2002	Identical
I.S. EN 61190-1-1:2002	Identical
IEC 61190-1-1:2002	Identical
BS EN 61190-1-1:2002	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

NF EN 61189-5 : 2008	TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
NF EN 61190-1-3 : 2008 AMD 1 2010	Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications

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