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    I.S. EN 61190-1-1:2002

    Current The latest, up-to-date edition.

    ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2002

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Requirements
      4.1 Conflict
      4.2 Flux classification and testing
          4.2.1 Standard classification for products
          4.2.2 Composition
          4.2.3 Activity
          4.2.4 Flux characterization test methods
          4.2.5 Qualification
          4.2.6 Quality conformance
          4.2.7 Performance
          4.2.8 Labelling
    5 Quality assurance provisions
      5.1 Responsibility for inspection
          5.1.1 Responsibility for compliance
          5.1.2 Test equipment and inspection facilities
          5.1.3 Inspection conditions
      5.2 Classification of inspections
      5.3 Materials inspection
      5.4 Qualification inspection
          5.4.1 Sample size
          5.4.2 Inspection routine
      5.5 Performance inspection
      5.6 Quality conformance
          5.6.1 Sampling plan
          5.6.2 Rejected lots
      5.7 Preparation of fluxes for testing
          5.7.1 Flux form for test
          5.7.2 Liquid fluxes
          5.7.3 Solid fluxes
          5.7.4 Paste flux
          5.7.5 Solder paste
          5.7.6 Other materials
    6 Preparation for delivery
      6.1 Preservation-packing and packaging
    7 Additional information
      7.1 Flux activity
      7.2 Flux and cleaning relationship
      7.3 Ordering data
    Annex A (normative)
    Bibliography

    Abstract - (Show below) - (Hide below)

    Describes general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
    IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    ISO 9455-16:2013 Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    ISO 9001:2015 Quality management systems — Requirements
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    ISO 9000:2015 Quality management systems — Fundamentals and vocabulary
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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